PTI Blog

To begin, let’s start with a brief overview of wedge bonding. Unlike ball bonding, wedge bonding does not have a flame-off action, as there ...

Posted by Palomar Technologies MarCom Team on October 25

Over the years, microelectronic wire bond process and packaging engineers have debated whether to use ball or wedge bond technologies. This ...

Posted by Palomar Technologies MarCom Team on November 4

The relentless increase in data processing requirements, network/cloud services, computing and web bandwidth advances, and soon-to-be-seen ...

Posted by Janine Powell on November 7

Wire bonding is a well-known process that has been around for many decades. It was all performed manually from the mid-1950s to the late ...

Posted by Janine Powell on January 3

[For the English version, click here.] В течение многих лет разварка проволочных перемычек является самым надежным и широко используемым ...

Posted by Janine Powell on July 19

In general, there are two main types of ultrasonic wire bonding: ball bonding and wedge bonding. Although thermosonic gold ball bonding is ...

Posted by Janine Powell on April 13

Although Palomar Technologies belongs to a niche industry, there are multiple markets in which we serve. Some of those markets include ...

Posted by Katie Finney on October 6

In den frühen 80igern began Palomar/Hughes mit der Entwicklung und Produktion von Wedge Bondern für die Luffahrt- und Rüstungsindustrie. ...

Posted by Katie Finney on August 25

This is the last blog of our mini-series which discusses the frequently asked questions for the 3800 Die Bonder, 8000i Wire Bonder, and the ...

Posted by Katie Finney on June 30

Palomar/Hughes started designing and manufacturing wedge bonders in the early 1980s for the aerospace and defense industries. Later, these ...

Posted by Katie Finney on May 12

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