The ABCs of LEDs – Wafers, X-axis & X-ray

W – Wafer While the microelectronics industry is working hard to develop low-cost LED packaging methods—such as with thermally and ...

Posted by Janine Powell on January 22

Large Work Area and Precision in Wafer Scale Optical Sub-Assemblies

Why is high accuracy required? And why is high accuracy important? In the context of bonding directly to wafer, +/- 1.5um allows for ...

Posted by Palomar Technologies MarCom Team on March 19

Contract Assembly Production, Materials & Equipment Data Management

Contract microelectronics assembly is all about production, uptime and yield, all of which require production regulation and process ...

Posted by Palomar Technologies MarCom Team on October 23

Niche Microelectronic Component Packaging: A Small-Town Hero Story

As a Vermont resident, business travel is always welcomed this time of year. The sub-zero temperatures as of late certainly helped me head ...

Posted by Palomar Technologies MarCom Team on January 24

Happy New Year from Palomar Technologies CEO

I would like to take a moment and thank you for your subscription to the PTI Blog. I hope you have found each weekly post both insightful ...

Posted by Palomar Technologies MarCom Team on December 27

Stack Die (3D IC) Assembly – Drivers and Challenges

With the increased demand for improved functionality and miniaturization in portable hand-held devices—such as cell phones, PDA, digital ...

Posted by on November 29