RF Process & Production

“IMS is THE place to be for high reliability packaging!” was the IMS Insider tweet from Palomar Technologies—and a very true statement ...

Posted by Janine Powell on June 11

Eutectic Die Attach: Technique for High-Accuracy Component Placement

Automated eutectic attachment is a leading technique for high-performance and high-capacity die attach applications. The needs of the ...

Posted by Palomar Technologies MarCom Team on October 2

HotRail Eutectic Assembly for RF Power Amplifier ICs

As telecommunications and information processing have exploded over the several decades, the need for extremely accurate, high-yield ...

Posted by Palomar Technologies MarCom Team on August 21

Big ROI from Small Footprint Die Bonders

Clean room space is expensive. Obtaining the highest component placement accuracies and the versatility of high-precision application ...

Posted by Palomar Technologies MarCom Team on June 28

Steady State Eutectic Attach using Force/Scrub

This is Part 3 of the Eutectic Die Bonding 101 series. In the previous 2 blogs, we discussed what "eutectic" means, the variables and ...

Posted by Palomar Technologies MarCom Team on October 23