[For the English version of this blog, click here.] Les interconnexions en câblage filaire dans l’électronique on traditionnellement été ...
Posted by Janine Powell on
Last year, I wrote a blog about general EFO theory. This edition will focus on the history of the “flame-off” and a few more advanced ...
Posted by Janine Powell on
March was a busy month for Palomar Technologies with exhibiting at both the iMAPS Device Packaging and OFC 2016 technical conferences. The ...
Posted by Katie Finney on
There was a time when our hi-rel customers would typically use what they called a “security bond” on the stitch bonds of their packages. ...
Posted by Katie Finney on
In terms of first-level interconnects, what is the absolute best possible condition? The answer would be mid-span wire breaks during ...
Posted by Janine Powell on
[For the English version, click here.] Традиционно, ультразвуковая микросварка предполагает разварку перемычек с кристалла на подложку. ...
Posted by Janine Powell on
[For English, click here.] 为了提高第二焊接点的可靠性，传统上是在第二个焊接点上焊上一个球(security bond)。虽然这种方法确实创造一个更可靠的焊线，它同时也导致产量的下降。这方法只能使用正向的焊线动作。 ...
Posted by Palomar Technologies MarCom Team on
Today’s microelectronic manufacturing environments seem to be constantly changing. One day you are building up traditional “flat-land” ...
Posted by Janine Powell on
[For English translation, click here.] La fiabilité d’un câblage par la technique nommée « Ball bonding » requière usuellement l’ajout ...
Posted by Palomar Technologies MarCom Team on
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