PTI Blog

Power electronics are present in our everyday lives in many applications. High-efficiency lighting, elevators, motor converters, solar ...

Posted by Palomar Technologies MarCom Team on June 29

One of the great shifts currently taking place in global defense sensor technologies, is due to a fundamental realignment of military ...

Posted by Palomar Technologies MarCom Team on June 1

A traditional means to justify the expense of purchasing new bonding equipment is to calculate the units per hour (UPH) of the proposed ...

Posted by Palomar Technologies MarCom Team on May 17

The die bonding, or die attach process, consists of attaching a die/chip to a substrate or package. This attachment can be performed with ...

Posted by Palomar Technologies MarCom Team on November 30

With all eyes on 2050 and the mid-century point, a highly ambitious series of global programs are in place to reduce carbon emissions ...

Posted by Palomar Technologies MarCom Team on July 21

In our last blog on combining bonder and vacuum reflow technologies, we presented a case for how to combine these technologies to ...

Posted by Palomar Technologies MarCom Team on April 29

It is not uncommon to see several different kinds of back-end assembly machines operating within close proximity to one another on a ...

Posted by Palomar Technologies MarCom Team on March 4

Power Semiconductors have enjoyed steady growth for at least the last 15 years, with only the occasional down turn. It is expected that the ...

Posted by Palomar Technologies MarCom Team on May 7

[For the English version, click here.] “如果您正在生产高价值的密封元件，在封装密封环中产生高空隙的后果是什么？” 封装密封圈中高度的空隙可能会导致泄漏故障，从而降低元件的可靠性和性能。 ...

Posted by Janine Powell on August 22

“If you are creating high value hermetically sealed devices, what are the consequences of experiencing high voids in the package seal ...

Posted by Katie Finney on June 21

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