How to Lower Moisture Levels in Microelectronic Components

Moisture on microelectronic components has a history of failure-inducing effects. These include electrical leakage, corrosion of metal ...

Posted by Janine Powell on May 24

Chinese translation: Die Attach with a Weight or Without a Weight. What’s the Difference?

[For the English version, click here.] Palomar 公司SST 国际推荐，设计，并制作有加上重量, ...

Posted by Janine Powell on May 10

Application of FEA in Graphite Tooling Design for Microelectronics Packaging

SST International utilizes graphite, among other materials, for tooling of microelectronics parts packaging. The superior characteristics ...

Posted by Katie Finney on February 16

Solutions de soudage eutectique sans manque de soudure (Void-Free Eutectic Die Attach Solutions: French Translation)

For a version of this blog in English, click here. Récemment, Palomar Technologies a acquis SST International en tant que partenaire dans ...

Posted by Katie Finney on January 19

Graphite for Microelectronic Thermal Assembly Processes

Artificial graphite is a unique engineered material that finds many uses in microelectronics assembly. SST International is starting a blog ...

Posted by Katie Finney on January 5

Void-Free Eutectic Die Attach Solutions (Chinese Translation)

[For a version of this blog in English, click here.] 最近Palomar Technologies收购了 SST 国际作为合作伙伴,为我们的客户提供整体的生产解决方案。两家公司在很多领域都有不同的功能. ...

Posted by Katie Finney on December 1

Wafer-Level Packaging for Integrated Circuits and MEMS

The International Wafer-Level Packaging Conference (IWLPC) was held in San Jose, California in October. Over 650 industry experts were in ...

Posted by Katie Finney on November 24

Void-Free Eutectic Die Attach Solutions

Recently, Palomar Technologies acquired SST International as a partner in providing our customers with total solutions. There are many ...

Posted by Janine Powell on November 3