PTI Blog

自动化带状键合 (Automated Ribbon Bonding)

[For the English version, click here.] 随着传统的混合和光电子封装频率上升,导致基本的键合工艺产生问题。主要的问题是反应性电感的产生。除此之外,反应性电容也是一个问题。但是,导线的形状从圆形改为扁带形就能直接影响反应性电感这个最关键问题。 ...

Posted by Janine Powell on

Automated Ribbon Bonding

As frequencies go up in traditional hybrid and optoelectronic packaging, the first level wire interconnect itself can become a problem. The ...

Posted by Janine Powell on

Recent Posts

By submitting this form, I agree to receive information about Palomar Technologies's products by email. I understand I can opt-out any time.