Automating Power Amplifier Packaging

A short case study in the shift from manual to automation is a good reminder of where we came from and where we are going in technology. It ...

Posted by Janine Powell on August 19

Micro-Dot Epoxy Pump Dispenser - GPD Fluid Dispense Solution

The search for a "complete, yet customized, solution to a microelectronics assembly requirement" is an all-too-common request from a ...

Posted by Palomar Technologies MarCom Team on August 7

SMT Hybrid Packaging 2011 in Nuremberg, Germany

Situated in the heart of Bavaria and with over half a million inhabitants, Nuremberg is one of Europe’s most beautiful cities, rich in ...

Posted by Palomar Technologies MarCom Team on May 5

Die and Wire Attach Systems - Staying on the Technology Treadmill

I think none of us would hesitate to say that things change pretty fast in this modern world. The pace of technology is just staggering. ...

Posted by Palomar Technologies MarCom Team on February 25

Bonder Software: Improving Yield

Advanced Packaging Software is arguably where a die or wire bonder is enabled to stretch and accomplish some extraordinary application ...

Posted by Palomar Technologies MarCom Team on August 27

Semicon West 2010 - Preview

July 13th - The DAY We are now only days away from Semicon West 2010, which opens at 10 AM on Tuesday, July 13th at the Moscone Center in ...

Posted by Palomar Technologies MarCom Team on July 8

Automating MEMs Packaging

The Micro-Electro-Mechanical Systems (MEMS), which once existed only in the university laboratory, are common in many commercial products ...

Posted by Palomar Technologies MarCom Team on September 17