Thinking Outside the Box, but Inside the Package

There are many companies that are on the leading edge of tackling packaging challenges and new processes. Customers often ask us if our ...

Posted by Janine Powell on December 2

Optoelectronics in the News

In light of the recent steps toward congressional endorsement of optics and photonics as a vital enabling technology for the economy (pun ...

Posted by Janine Powell on August 12

Sourcing Process Expertise for High-Precision Assembly

Near-sourcing, out-sourcing, in-sourcing, crowd-sourcing, group-sourcing—which one is right for your organization? Palomar Technologies' ...

Posted by Janine Powell on July 2

Micro-Dot Epoxy Pump Dispenser - GPD Fluid Dispense Solution

The search for a "complete, yet customized, solution to a microelectronics assembly requirement" is an all-too-common request from a ...

Posted by Palomar Technologies MarCom Team on August 7

Stack Die (3D IC) Assembly – Drivers and Challenges

With the increased demand for improved functionality and miniaturization in portable hand-held devices—such as cell phones, PDA, digital ...

Posted by on November 29

Semicon West 2010 - Preview

July 13th - The DAY We are now only days away from Semicon West 2010, which opens at 10 AM on Tuesday, July 13th at the Moscone Center in ...

Posted by Palomar Technologies MarCom Team on July 8

Automating MEMs Packaging

The Micro-Electro-Mechanical Systems (MEMS), which once existed only in the university laboratory, are common in many commercial products ...

Posted by Palomar Technologies MarCom Team on September 17