The Growing RF and Microwave Industries – Packaging Challenges and Solutions
Do you happen to know someone who does not own some type of wireless device? It is becoming rarer today to meet someone who does not. ...
Posted by Janine Powell on
Do you happen to know someone who does not own some type of wireless device? It is becoming rarer today to meet someone who does not. ...
Posted by Janine Powell on
[For the English version, click here.] 虽然虽半导体封装行业继续不断努力,设法缩小产品的体积以及永无止境的追求成本的节约,但是仍然有相当数量的应用程序需要一套完全不同的贴片和键合功能。 ...
Posted by Janine Powell on
Eutectic bonding of Au-backed MMIC (Monolithic Microwave Integrated Circuits) power amplifiers presents a unique challenge due to the thin, ...
Posted by Janine Powell on
Although there is continued effort in the semiconductor packaging industry to reduce package size along with the never-ending pursuit of ...
Posted by Janine Powell on
Throughout the history of electronics manufacturing, there have been distinct boundaries between those that assemble SMT components and ...
Posted by Palomar Technologies MarCom Team on
"Unleash the RF/Microwaves!" There was an a recent ad in the Microwave Journal that proclaimed this, but it could be the rallying cry at ...
Posted by Palomar Technologies MarCom Team on
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