PTI Blog

Moisture on microelectronic components has a history of failure-inducing effects. These include electrical leakage, corrosion of metal ...

Posted by Janine Powell on May 24

There was a lot of buzz last week surrounding Apple’s announcement regarding new product releases and enhancements. With the release of the ...

Posted by Janine Powell on September 16

As microelectronics device designs evolve, so must handling and assembly processes. Die sorting is used to separate die of one wafer into ...

Posted by Janine Powell on October 8

SEMICON West is the flagship annual event for the global microelectronics industry. It is the premier event for the display of new products ...

Posted by Janine Powell on August 13

SEMICON West 2013 is barely two weeks away; attendees are just days away from over 50 hours of technical programs and focused access to ...

Posted by Janine Powell on June 25

Multi-Chip Module packaging is an important facet of modern electronic miniaturization and micro-electronic systems. Demand for further ...

Posted by Janine Powell on April 30

Throughout the history of electronics manufacturing, there have been distinct boundaries between those that assemble SMT components and ...

Posted by Palomar Technologies MarCom Team on October 9

As microelectronics device designs evolve, so must handling and assembly processes. A common example is with the process of removing ...

Posted by on September 11

While 3D packaging and reliability was a reoccurring topic throughout the ECTC 2012 exhibit hall conversations, traditional 2D packaging ...

Posted by Palomar Technologies MarCom Team on June 5

In anticipation of the market’s growing demand for MEMS products, a high-volume, high-yield manufacturing solution is the answer: Design ...

Posted by Palomar Technologies MarCom Team on May 8

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