Automated Epoxy Die Attach

The growing popularity of hybrid microcircuits is partially due to their built-in flexibility and small package size. Aerospace and ...

Posted by Janine Powell on October 22

RF Process & Production

“IMS is THE place to be for high reliability packaging!” was the IMS Insider tweet from Palomar Technologies—and a very true statement ...

Posted by Janine Powell on June 11

Multi-Chip Modules & Stacked Die Assemblies

Multi-Chip Module packaging is an important facet of modern electronic miniaturization and micro-electronic systems. Demand for further ...

Posted by Janine Powell on April 30

Flexible Wire Bonding in Complex Hybrid Markets

Today’s microelectronic manufacturing environments seem to be constantly changing. One day you are building up traditional “flat-land” ...

Posted by Janine Powell on April 9

Combining Surface Mount Technology (SMT) & Microelectronics Assembly

Throughout the history of electronics manufacturing, there have been distinct boundaries between those that assemble SMT components and ...

Posted by Palomar Technologies MarCom Team on October 9

Demonstrating Hybrid and MCM packaging applications

Today's production facilities have their own unique set of components, design characteristics and assembly requirements. Before purchasing ...

Posted by Palomar Technologies MarCom Team on August 9

Automation & Expertise in Contract Assembly

Taking from our last post, we determined that the playing field of contract assembly in complex microelectronics, in regards to cost has ...

Posted by Palomar Technologies MarCom Team on January 22