Mixed Attachment Technology in RF & Optoelectronic Packages

The increasingly densely populated and higher power levels of RF & Optoelectronic packages are creating unique challenges for assembly ...

Posted by Janine Powell on April 23

Overcoming Placement Accuracy Challenges for Print Head Alignment

Have you ever had an ink jet printer that no matter what you did to calibrate it, you still had a bit of a blur? How you must have cringed ...

Posted by Janine Powell on April 2

Eutectic Solder Die Attach for High-Powered Devices

Die bonding with eutectic solder processing is becoming more important as thermal challenges increase with the proliferation of laser diode ...

Posted by Palomar Technologies MarCom Team on August 23

Big ROI from Small Footprint Die Bonders

Clean room space is expensive. Obtaining the highest component placement accuracies and the versatility of high-precision application ...

Posted by Palomar Technologies MarCom Team on June 28

Optoelectronic Products Case Studies for Micron-Level Placement Accuracy

Applications requiring ultra-high-placement accuracies of 1μm to 3μm are resurfacing in several optoelectronic applications such as Arrayed ...

Posted by Palomar Technologies MarCom Team on April 28