The Growing RF and Microwave Industries – Packaging Challenges and Solutions
Do you happen to know someone who does not own some type of wireless device? It is becoming rarer today to meet someone who does not. ...
Posted by Janine Powell on
PTI Blog
Answering the Question: “Does Your Die Bonder Perform Flip Chip?”
Palomar recently exhibited at two very high tech shows in Florida: Electronics Component and Technology Conference (ECTC) and the ...
Posted by Janine Powell on
RF Process & Production
“IMS is THE place to be for high reliability packaging!” was the IMS Insider tweet from Palomar Technologies—and a very true statement ...
Posted by Janine Powell on
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