PTI Blog

Gold ball bumping is primarily used to make interconnects for flip chip bonded die. This process involves placing a single bump (or stacked ...

Posted by Janine Powell on September 12

There are many different directions to go in when it comes to part presentation stages—from that simple part built by the thousands yearly, ...

Posted by Janine Powell on January 31

[Read the English version of the blog here.] Bien que la tendance évolue défavorablement envers le fil d’or dans le câblage de grande ...

Posted by Janine Powell on January 17

In wire bonding, a gold ball is forced down and thermosonically bonded to a die-bond pad forming the first connection of an integrated ...

Posted by Janine Powell on June 28

[For the English version, click here.] Le micro-câblage par fil d’or (ball bonding) est toujours la méthode prédominante pour les ...

Posted by Janine Powell on October 28

Though the trend is moving away from gold wire for high-volume production wire bonding, gold ball wire bonding still makes up about 50 ...

Posted by Janine Powell on February 11

Much has been written about using Design of Experiments to optimize the input parameters to an automatic wire bonder in order identify the ...

Posted by Janine Powell on February 5

[For the English version, click here.] Soldagem de fio de bola de ouro Ouro (Au) ainda é o método predominante para interconexões em ...

Posted by Janine Powell on July 16

[For the English version, click here.] Gold (Au) Ball- Drahtbonden ist immer noch die beherrschende Verbindungsmethode in der ...

Posted by Janine Powell on May 7

Gold (Au) ball wire bonding is still the predominate method for interconnects in microelectronics. Industries are further utilizing novel ...

Posted by Janine Powell on April 16

Prev 1 2 Next