PTI Blog

Gold Ball Bumping Factors and Benefits

In wire bonding, a gold ball is forced down and thermosonically bonded to a die-bond pad forming the first connection of an integrated ...

Posted by Janine Powell on

Comparing Au, Pt, Ag and Cu Wire Bonding

With the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the ...

Posted by Janine Powell on

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