Gold Ball Bumping Factors and Benefits
In wire bonding, a gold ball is forced down and thermosonically bonded to a die-bond pad forming the first connection of an integrated ...
Posted by Janine Powell on
In wire bonding, a gold ball is forced down and thermosonically bonded to a die-bond pad forming the first connection of an integrated ...
Posted by Janine Powell on
With the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the ...
Posted by Janine Powell on
Throughout the history of electronics manufacturing, there have been distinct boundaries between those that assemble SMT components and ...
Posted by Palomar Technologies MarCom Team on
Mobile electronic products continually require finer geometries for packaged integrated circuits. Wireless phones, PDA and digital cameras ...
Posted by Palomar Technologies MarCom Team on
Continuing on with our overview of microelectronic interconnection methods, we will discuss three additional methods: Solder Bump Bonding, ...
Posted by Palomar Technologies MarCom Team on
By submitting this form, I agree to receive information about Palomar Technologies's products by email. I understand I can opt-out any time.