The semiconductor packaging industry continues a relentless pursuit to make smaller packages with higher throughput. The industry demand ...
Posted by Palomar Technologies MarCom Team on
In wire bonding, a gold ball is forced down and thermosonically bonded to a die-bond pad forming the first connection of an integrated ...
Posted by Janine Powell on
March was a busy month for Palomar Technologies with exhibiting at both the iMAPS Device Packaging and OFC 2016 technical conferences. The ...
Posted by Katie Finney on
Palomar recently exhibited at two very high tech shows in Florida: Electronics Component and Technology Conference (ECTC) and the ...
Posted by Janine Powell on
Often when companies are discussing potential projects, they are at a crossroads on the most economical way to proceed with a small ...
Posted by Janine Powell on
As microelectronics device designs evolve, so must handling and assembly processes. Die sorting is used to separate die of one wafer into ...
Posted by Janine Powell on
Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and ...
Posted by Janine Powell on
It's hard to believe we're already well into the new year. Echoing the happy new year well wishes from our CEO, the entire Palomar ...
Posted by Palomar Technologies MarCom Team on
This week marks the Thanksgiving holiday, a time to celebrate autumn and give thanks with friends and family. Thanksgiving can also be a ...
Posted by Palomar Technologies MarCom Team on
As microelectronics device designs evolve, so must handling and assembly processes. A common example is with the process of removing ...
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