PTI Blog

There are a myriad of differences between eutectic or epoxy die attach methods. There are some obvious trade-offs and benefits to both, ...

Posted by Palomar Technologies MarCom Team on December 18

[For English version, please download the complete article or the introduction to eutectic die attach eBook!] 高精度组件放置的技术引言共晶结合是如何形成的 ...

Posted by Palomar Technologies MarCom Team on November 27

LEDs 2012 was another well-attended international conference, held at the Hilton on the San Diego bay. Attendance has been up year over ...

Posted by on November 6

"Fifty years ago today, 33-year-old GE scientist Dr. Nick Holonyak, Jr., invented the first practical visible-spectrum light-emitting diode ...

Posted by Palomar Technologies MarCom Team on October 16

Automated eutectic attachment is a leading technique for high-performance and high-capacity die attach applications. The needs of the ...

Posted by Palomar Technologies MarCom Team on October 2

Today's telecommunications/datacom industry is coping with its own technical challenges in processing capabilities through the continuous ...

Posted by Palomar Technologies MarCom Team on March 6

The medium used for component attach is key aspect of LED assembly. There is ample evidence that gold-tin (Au/Sn) yields the highest ...

Posted by on February 28

Well, it is that time of year again. This week is the 44th International Symposium on Microelectronics - IMAPS 2011. This year's conference ...

Posted by Palomar Technologies MarCom Team on October 12

High power transistor, laser and LED devices require packaging to remove thermal energy from the die. Although some silver filled epoxies ...

Posted by Palomar Technologies MarCom Team on March 12

With the successful deployment of the Pulse Heat Stage (PHS) system from Palomar Technologies, our field sales and engineering teams often ...

Posted by Palomar Technologies MarCom Team on February 1

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