In our last blog on combining bonder and vacuum reflow technologies, we presented a case for how to combine these technologies to ...
Posted by Palomar Technologies MarCom Team on
For a version of this blog in English, click here. Récemment, Palomar Technologies a acquis SST International en tant que partenaire dans ...
Posted by Katie Finney on
[For a version of this blog in English, click here.] 最近Palomar Technologies收购了 SST 国际作为合作伙伴,为我们的客户提供整体的生产解决方案。两家公司在很多领域都有不同的功能. ...
Posted by Katie Finney on
Recently, Palomar Technologies acquired SST International as a partner in providing our customers with total solutions. There are many ...
Posted by Janine Powell on
For applications that have strict temperature parameters, eutectic die attachment is typically the best solution. Epoxies and other fluid ...
Posted by Janine Powell on
Eutectic bonding of Au-backed MMIC (Monolithic Microwave Integrated Circuits) power amplifiers presents a unique challenge due to the thin, ...
Posted by Janine Powell on
U – Uniformity We are seeing more and more innovation in form factor and functionality in solid-state lighting products as lighting ...
Posted by Janine Powell on
The increasingly densely populated and higher power levels of RF & Optoelectronic packages are creating unique challenges for assembly ...
Posted by Janine Powell on
[For English version, please download the complete article or the introduction to eutectic die attach eBook!] 高精度组件放置的技术 引言 共晶结合是如何形成的 ...
Posted by Palomar Technologies MarCom Team on
LEDs 2012 was another well-attended international conference, held at the Hilton on the San Diego bay. Attendance has been up year over ...
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