Achieving High Accuracy Pattern Recognition for Die Bonding
When it comes to microelectronics and photonics packaging assembly, components such as die are placed onto packages. All automated die ...
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PTI Blog
Challenge Us with Your Microelectronics Packaging Needs in 2013
It's hard to believe we're already well into the new year. Echoing the happy new year well wishes from our CEO, the entire Palomar ...
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Eutectic or Epoxy? Considerations for Production Throughput
There are a myriad of differences between eutectic or epoxy die attach methods. There are some obvious trade-offs and benefits to both, ...
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Production Line Equipment Solutions - Palomar's "Extended Family"
This week marks the Thanksgiving holiday, a time to celebrate autumn and give thanks with friends and family. Thanksgiving can also be a ...
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Flip Chip & MEMS Assembly with High-Mix, Automatic Die Sorters
As microelectronics device designs evolve, so must handling and assembly processes. A common example is with the process of removing ...
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Micro-Dot Epoxy Pump Dispenser - GPD Fluid Dispense Solution
The search for a "complete, yet customized, solution to a microelectronics assembly requirement" is an all-too-common request from a ...
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Accurate Bond-Line Thickness for Enhanced Performance of Critical Die
Today, the demands for smaller packages require highly reliable thermal coupling to associated packages. Therefore, bondline thickness must ...
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Die Bonder "Elemental Basics" for Interconnect Processes
SEMICON West 2011 was a busy show. Attendance was up, and the flow of people through the packaging exhibit area was steady throughout the ...
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Big ROI from Small Footprint Die Bonders
Clean room space is expensive. Obtaining the highest component placement accuracies and the versatility of high-precision application ...
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SEMICON China 2011 Reflection | Showcasing the 3500-III Die Bonder
美国PALOMAR 公司成立于1975年,早期隶属于美国休斯航空公司(Hughes Aircraft )的工业产品事业部,主要从事半导体设备的开发与研究.PALOMAR 公司至成立之日就致力于服务美国军工和高科技企业领域高端封装设备的供应.在该领域有70%以上的市场. ...
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