PTI Blog

Two Processes for Eutectic Die Bonding

Assembly Services has two separate processes available for eutectic bonding available in our lab. We can utilize our 3880 or 6500 Die ...

Posted by Janine Powell on

Au Ball Wire Bonding with Heated Tool

Gold (Au) ball wire bonding is still the predominate method for interconnects in microelectronics. Industries are further utilizing novel ...

Posted by Janine Powell on

IMAPS 2009 San Jose - Review

IMAPS 2009 in San Jose was, as expected, slow due to current economic conditions. It was evident that reduced travel budgets and last ...

Posted by Palomar Technologies MarCom Team on

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