PTI Blog

The growing popularity of hybrid microcircuits is partially due to their built-in flexibility and small package size. Aerospace and ...

Posted by Janine Powell on October 22

Throughout the history of electronics manufacturing, there have been distinct boundaries between those that assemble SMT components and ...

Posted by Palomar Technologies MarCom Team on October 9

With the ever-evolving trend for smaller applications, the capability to produce high-precision, high-reliability component bonding remains ...

Posted by Palomar Technologies MarCom Team on July 31

With the increased demand for improved functionality and miniaturization in portable hand-held devices—such as cell phones, PDA, digital ...

Posted by on November 29

The SEMICON West 2011 show floor has been buzzing with confidence and optimism for the microelectronic packaging industry. “SEMICON West is ...

Posted by Palomar Technologies MarCom Team on July 14

Situated in the heart of Bavaria and with over half a million inhabitants, Nuremberg is one of Europe’s most beautiful cities, rich in ...

Posted by Palomar Technologies MarCom Team on May 5

February 4th marks “National Go Red Day” in efforts to raise awareness of heart disease in the US. The statistics of Americans—primarily ...

Posted by on February 4

There is no shortage of good ideas. What is rare, and valuable, is the execution of a good idea. This is most important in the context of ...

Posted by Palomar Technologies MarCom Team on September 16

Advanced Packaging Software is arguably where a die or wire bonder is enabled to stretch and accomplish some extraordinary application ...

Posted by Palomar Technologies MarCom Team on August 27

Quick note: "Other" in the suject is referring to wire bonding and die attach, and the sub-sets that come with them, ie epoxy, eutectic, ...

Posted by Palomar Technologies MarCom Team on May 10

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