A Unified Solution for Microelectronics Packaging

With over 30 years in the business, Palomar Technologies and Royce Instruments both have a rich history of microelectronics equipment ...

Posted by Janine Powell on August 16

Automated & Semi-Automated Die Sorting

As microelectronics device designs evolve, so must handling and assembly processes. Die sorting is used to separate die of one wafer into ...

Posted by Janine Powell on October 8

Challenge Us with Your Microelectronics Packaging Needs in 2013

It's hard to believe we're already well into the new year. Echoing the happy new year well wishes from our CEO, the entire Palomar ...

Posted by Palomar Technologies MarCom Team on January 8

Production Line Equipment Solutions - Palomar's "Extended Family"

This week marks the Thanksgiving holiday, a time to celebrate autumn and give thanks with friends and family. Thanksgiving can also be a ...

Posted by Palomar Technologies MarCom Team on November 20

Introduction to Wire Bond Pull & Ball Shear Testing

In microelectronics production environments, bond testing can provide a means of evaluating bond quality and verifying bond consistency and ...

Posted by Janine Hueners on November 13

Europe's Leading Event for System Integration in Microelectronics

SMT Hybrid Packaging is Europe's leading event on system integration in microelectronics. From 8–10 May, 2012, over 565 exhibitors ...

Posted by Palomar Technologies MarCom Team on May 22

Live Demos of Large Work Area Wire Bonder & Universal Bond Tester (Productronica 2011)

Productronica is the world’s leading international trade fair for innovative electronics production. The 2011 show—held at a large modern ...

Posted by Palomar Technologies MarCom Team on November 22

Universal Bond Tester for Hi-Rel Wire Bond & Die Attach Applications

Once wire bonding or die bonding is complete, the next step in the microelectronics assembly process is to test the quality of the ...

Posted by Palomar Technologies MarCom Team on October 10