Ball Bumping as an Alternative to Plating: Challenges and Benefits

Often when companies are discussing potential projects, they are at a crossroads on the most economical way to proceed with a small ...

Posted by Janine Powell on February 18

Combining Surface Mount Technology (SMT) & Microelectronics Assembly

Throughout the history of electronics manufacturing, there have been distinct boundaries between those that assemble SMT components and ...

Posted by Palomar Technologies MarCom Team on October 9

Repeatable Free Air Balls (FABs): High-Precision, High-Speed Ball Bonder

To live today without the assisitance and support of microelectronic-controlled devices is borderline unthinkable—unless you are romantic ...

Posted by Palomar Technologies MarCom Team on July 17

Geometry & Bond Improvements for Wire Ball Bonding & Ball Bumping

Mobile electronic products continually require finer geometries for packaged integrated circuits. Wireless phones, PDA and digital cameras ...

Posted by Palomar Technologies MarCom Team on May 15

Live Demos of Large Work Area Wire Bonder & Universal Bond Tester (Productronica 2011)

Productronica is the world’s leading international trade fair for innovative electronics production. The 2011 show—held at a large modern ...

Posted by Palomar Technologies MarCom Team on November 22

Ultra High-Reliability Wire Bonding

High-reliability wire bonding traditionally required the addition of a security bond over the stitch—or second bond—of each ball bonded ...

Posted by Palomar Technologies MarCom Team on April 20

Solder Bump Bonding, Ball Bumps and Wire Bonds

Continuing on with our overview of microelectronic interconnection methods, we will discuss three additional methods: Solder Bump Bonding, ...

Posted by Palomar Technologies MarCom Team on May 24