PTI Blog

To begin, let’s start with a brief overview of wedge bonding. Unlike ball bonding, wedge bonding does not have a flame-off action, as there ...

Posted by Palomar Technologies MarCom Team on October 25

[For the English version, click here.] В течение многих лет разварка проволочных перемычек является самым надежным и широко используемым ...

Posted by Janine Powell on July 19

In wire bonding, a gold ball is forced down and thermosonically bonded to a die-bond pad forming the first connection of an integrated ...

Posted by Janine Powell on June 28

In general, there are two main types of ultrasonic wire bonding: ball bonding and wedge bonding. Although thermosonic gold ball bonding is ...

Posted by Janine Powell on April 13

There was a lot of buzz last week surrounding Apple’s announcement regarding new product releases and enhancements. With the release of the ...

Posted by Janine Powell on September 16

[For the English version, click here.] Традиционно, ультразвуковая микросварка предполагает разварку перемычек с кристалла на подложку. ...

Posted by Janine Powell on January 21

Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and ...

Posted by Janine Powell on July 23

[For the English version, click here.] Soldagem de fio de bola de ouro Ouro (Au) ainda é o método predominante para interconexões em ...

Posted by Janine Powell on July 16

[For the English version, click here.] Gold (Au) Ball- Drahtbonden ist immer noch die beherrschende Verbindungsmethode in der ...

Posted by Janine Powell on May 7

Gold (Au) ball wire bonding is still the predominate method for interconnects in microelectronics. Industries are further utilizing novel ...

Posted by Janine Powell on April 16

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