Ball Bonding and the Electronic Flame-Off Process
Ball bonding starts with a gold ball on the end of a very fine wire and must be very consistent in it's Free-Air Ball (FAB) size. This is ...
Posted by Katie Finney on
Ball bonding starts with a gold ball on the end of a very fine wire and must be very consistent in it's Free-Air Ball (FAB) size. This is ...
Posted by Katie Finney on
There was a time when our hi-rel customers would typically use what they called a “security bond” on the stitch bonds of their packages. ...
Posted by Katie Finney on
Today’s multipurpose wire bonding machines are required to deliver a combination of wires, bumps, and specialty interconnects for RF, ...
Posted by Janine Powell on
[For English translation, click here.] La fiabilité d’un câblage par la technique nommée « Ball bonding » requière usuellement l’ajout ...
Posted by Palomar Technologies MarCom Team on
Throughout the history of electronics manufacturing, there have been distinct boundaries between those that assemble SMT components and ...
Posted by Palomar Technologies MarCom Team on
SEMICON West is the flagship annual event for the microelectronics industry, with 2012 bringing together 690 exhibiting companies from 21 ...
Posted by Palomar Technologies MarCom Team on
To live today without the assisitance and support of microelectronic-controlled devices is borderline unthinkable—unless you are romantic ...
Posted by Palomar Technologies MarCom Team on
SMT Hybrid Packaging is Europe's leading event on system integration in microelectronics. From 8–10 May, 2012, over 565 exhibitors ...
Posted by Palomar Technologies MarCom Team on
Mobile electronic products continually require finer geometries for packaged integrated circuits. Wireless phones, PDA and digital cameras ...
Posted by Palomar Technologies MarCom Team on
In anticipation of the market’s growing demand for MEMS products, a high-volume, high-yield manufacturing solution is the answer: Design ...
Posted by Palomar Technologies MarCom Team on
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