PTI Blog

In the past few months we have had the opportunity to work with potential customers who are looking to make the jump from manual die and ...

Posted by Katie Finney on August 4

A short case study in the shift from manual to automation is a good reminder of where we came from and where we are going in technology. It ...

Posted by Janine Powell on August 19

When we think of microelectronics manufacturing, we usually think about manual equipment, semi-automatic equipment, and fully automatic ...

Posted by Janine Powell on December 10

As microelectronics device designs evolve, so must handling and assembly processes. Die sorting is used to separate die of one wafer into ...

Posted by Janine Powell on October 8

Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and ...

Posted by Janine Powell on July 23

SEMICON West 2013 is barely two weeks away; attendees are just days away from over 50 hours of technical programs and focused access to ...

Posted by Janine Powell on June 25

Why is high accuracy required? And why is high accuracy important? In the context of bonding directly to wafer, +/- 1.5um allows for ...

Posted by Palomar Technologies MarCom Team on March 19

Yole Développement recently met with David Rasmussen, Assembly Services general manager, to discuss automated die bonding tools for today's ...

Posted by Palomar Technologies MarCom Team on January 15

[For English version, please download the complete article or the introduction to eutectic die attach eBook!] 高精度组件放置的技术引言共晶结合是如何形成的 ...

Posted by Palomar Technologies MarCom Team on November 27

This week marks the Thanksgiving holiday, a time to celebrate autumn and give thanks with friends and family. Thanksgiving can also be a ...

Posted by Palomar Technologies MarCom Team on November 20

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