New Advances in Ultra-Short Bond Span and Ultra-Low Loop Profile

The proliferation of mobile devices, IP traffic, video-on-demand mobile and home, and Internet of Things continues to drive an exponential ...

Posted by Janine Powell on October 25

Micro-câblage par fil d’or avec outil chauffé (Au Ball Wire Bonding with Heated Tool)

[For the English version, click here.] Le micro-câblage par fil d’or (ball bonding) est toujours la méthode prédominante pour les ...

Posted by Janine Powell on October 28

Soldagem de Fio Bola de Ouro com Ferramenta Aquecida (Au Ball Wire Bonding with Heated Tool)

[For the English version, click here.] Soldagem de fio de bola de ouro Ouro (Au) ainda é o método predominante para interconexões em ...

Posted by Janine Powell on July 16

可靠性超高的键合方案 (Ultra High-Reliability Wire Bonding)

[For English, click here.] 为了提高第二焊接点的可靠性，传统上是在第二个焊接点上焊上一个球(security bond)。虽然这种方法确实创造一个更可靠的焊线，它同时也导致产量的下降。这方法只能使用正向的焊线动作。 ...

Posted by Palomar Technologies MarCom Team on June 4

Gold Ballbonden mit beheizter Kapillare

[For the English version, click here.] Gold (Au) Ball- Drahtbonden ist immer noch die beherrschende Verbindungsmethode in der ...

Posted by Janine Powell on May 7

Au Ball Wire Bonding with Heated Tool

Gold (Au) ball wire bonding is still the predominate method for interconnects in microelectronics. Industries are further utilizing novel ...

Posted by Janine Powell on April 16

Comparing Au, Pt, Ag and Cu Wire Bonding

With the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the ...

Posted by Janine Powell on February 5

Introduction to Wire Bond Pull & Ball Shear Testing

In microelectronics production environments, bond testing can provide a means of evaluating bond quality and verifying bond consistency and ...

Posted by Janine Hueners on November 13

Gold-Tin Eutectic Solder Advantages for LED Assembly

LEDs 2012 was another well-attended international conference, held at the Hilton on the San Diego bay. Attendance has been up year over ...

Posted by on November 6

Eutectic Die Attach: Technique for High-Accuracy Component Placement

Automated eutectic attachment is a leading technique for high-performance and high-capacity die attach applications. The needs of the ...

Posted by Palomar Technologies MarCom Team on October 2