PTI Blog

Ball Bonding vs. Wedge Bonding

For many years, wire bonding has been the most robust and commonly used method for chip-to-die interconnection of lead-frame, integrated ...

Posted by Janine Powell on

The 411 on Handlers

Handlers are bonder options that can bring great value and efficiency to your assembly process. For example, on the 8000 Wire Bonder, ...

Posted by Janine Powell on

Automating MEMs Packaging

The Micro-Electro-Mechanical Systems (MEMS), which once existed only in the university laboratory, are common in many commercial products ...

Posted by Palomar Technologies MarCom Team on

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