Wafer-Level Packaging for Integrated Circuits and MEMS
The International Wafer-Level Packaging Conference (IWLPC) was held in San Jose, California in October. Over 650 industry experts were in ...
Posted by Katie Finney on
The International Wafer-Level Packaging Conference (IWLPC) was held in San Jose, California in October. Over 650 industry experts were in ...
Posted by Katie Finney on
IMAPS 2012 delivered another great conference covering a wide array of topics. Held this year in San Diego, hundreds of industry peers, ...
Posted by Palomar Technologies MarCom Team on
To live today without the assisitance and support of microelectronic-controlled devices is borderline unthinkable—unless you are romantic ...
Posted by Palomar Technologies MarCom Team on
"Unleash the RF/Microwaves!" There was an a recent ad in the Microwave Journal that proclaimed this, but it could be the rallying cry at ...
Posted by Palomar Technologies MarCom Team on
While 3D packaging and reliability was a reoccurring topic throughout the ECTC 2012 exhibit hall conversations, traditional 2D packaging ...
Posted by Palomar Technologies MarCom Team on
Mobile electronic products continually require finer geometries for packaged integrated circuits. Wireless phones, PDA and digital cameras ...
Posted by Palomar Technologies MarCom Team on
With the increased demand for improved functionality and miniaturization in portable hand-held devices—such as cell phones, PDA, digital ...
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Manufacturers are constantly confronted with device integration challenges as consumers want electronics to be smaller, more easily ...
Posted by Palomar Technologies MarCom Team on
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