PTI Blog

The Frequently Asked Questions Mini-Series: 8000i Wire Bonder Part One

Posted by Katie Finney on Tue, Jun 16, 2015 @ 01:11 PM

This is the second blog of the Frequently Asked Questions mini-series. This mini-series discusses the frequently asked questions for the 3800 Die Bonder, 8000i Wire Bonder, and the 9000 Wedge Bonder. Check back each week to see the most frequently asked questions for your favorite machines. This week we are discussing the 8000i Wire Bonder. We have split the frequently asked questions for the 8000i into two blogs, since there are so many questions. Check back next week for part two.

8000i Wire Bonder

What is the total bonding area that you can vision and bond to?
12” (305mm) in the X axis, 6” (152mm) in the Y axis

What is the range of capillary lengths the 8000i can bond with?
The Model 8000i can bond with a wide range of capillaries. We recommend using the shortest cap that works with your application. The most common length is 0.437”. If that is too short, then next typical length is 0.625”. You can bond with high reliability all the way up to a 0.750” cap. There are other sizes that work in between these typical lengths as well:

  • 11.10mm (0.437 inch)-Standard
  • 11.94mm (0.470 inch)-Standard
  • 15.88mm (0.625 inch)-Standard
  • 19.05mm (0.750 inch)-Optional

What can we do if we cannot heat the package up to 150C?
8000i_hi_resA number of methods for adding ‘activation energy’ to the bond can be employed. In all cases, we still recommend that you heat the bottom of the package as hot as possible, up to 150⁰C.  If you can heat the package from the bottom to approximately 85-125⁰C, we can add the last bit of energy by heating the capillary itself with what we call a ‘tool heater.’ This is a temperature controlled inductive coil that wraps a number of times around the capillary. In some cases, this coil is driven quite hard, up to the low 300⁰C region.  It does reduce some clearances and depth access, so your application needs to be reviewed prior to launching down this pathway. It does provide a robust solution to lower package temperatures.

Can the system perform both ball bumping and traditional wire bonding with traditional wire and capillaries?
Yes, it can. The 8000i Wire Bonders’ compound Z-Axis allows the system to bond traditional ball/stitch wires, ball bumps or stacked ball bumps of many shapes and sizes, or a combination of the two that we call “Stand-Off Stitch” bonding.The SoS mode provides the highest degree of reliability available for ball bonders on the market today.

What types/sizes of heated stages do you offer?

  • Heated Stage: 6 x 4 inches. Mechanical and vacuum clamping.  Includes a work stage bracket and a removable top plate that can be modified to improve clamping and utility.Top plate print will be provided for each of these stages so the customer can modify quickly at a reasonable expense.
  • Heated Wafer Stage: 6 x 6 inches –vacuum clamping only. Includes one removable top plate that can be modified to fit various parts; this stage can also be used with the new ergonomic keyboard kit.
  • Heated Stage: 8 x 8 inches Heated Area. Mechanical and vacuum clamping.  Includes a removable top plate that can be modified to improve clamping (Includes a work stage bracket).
  • Heated stage: 10 x 6 inches. Mechanical and vacuum clamping. Includes a work bracket and a removable top plate that can be modified to improve clamping.
  • Heated Stage: 12 x 6 inches. Mechanical and vacuum clamping. Includes a work bracket and a removable top plate that can be modified to improve clamping.
  • Dual Heated Wafer Stage: 6 x 6 inches. Heated area-vacuum only. Includes one removable top plate per stage that can be modified to fit various parts; this stage can also be used with the new ergonomic keyboard kit and can provide continuous bonding technology.
  • Variable Wafer stage: 4 inches, 6 inches, 8 inches. Vacuum clamping only.  Variable wafer stage with modified top plate to accommodate different size wafers.

Can the system be configured with a tool heater?
Yes, the 8000i Wire Bonder can be configured to use the option tool heater, either at the factory prior to acceptance testing or later in the field at the customer’s site.

Can the system be configured with a material handling system?
Yes, the system can have a variety of material handlers: Inline handlers, push-pull handlers, auto-continuous handlers, etc. each with its own custom tooling.  These options can be manually fed materials, or for the inline handlers, low and high capacity up and downstream magazine handlers that can connect via a true SMEMA interface.

What ultrasonic frequency does the bonder run at, and can the system be configured for High Frequency Ultrasonics?
The standard system operates at 60 KHz. This is highly recommended, as higher frequencies come at a process capability price. The unit can also be converted, at the factory or in the field to 120 KHz ultrasonics. These high frequency options allow for better bonding at lower temperatures and can provide a finer pitch result.

Download these resources for more information:

8000i Data Sheet i2Gi® eBook Field Services Data Sheet
 8000i wire bonder, ball bumper, i2Gi  i2Gi, modern wire bond control software, intelligent interactive graphical interface  field services support data sheet

If you have more questions about the 8000i Wire Bonder, please contact Katie Finney at [email protected]. Don’t miss the second part of the frequently asked questions for the 8000i next week.

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Bradley Benton
Regional Account Manager, Western Americas
Palomar Technologies, Inc.