Great Addition to Palomar Technologies' Equipment Portfolio: SST International Model 5100

Palomar Technologies’ Assembly Services group has added an SST International Model 5100 vacuum reflow oven to its installed equipment portfolio. We can now do batch reflow of AuSn eutectic applications that do not require precision placement. We can also do hermetic sealing with this oven. We have successfully performed a hermetic sealing application for one of our customers with great results.

The SST International Model 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates. This system allows for heating up to 500°C and cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig. An unlimited number of process profiles can easily be created and stored in the controller. Process heating is provided over the entire work area by a close-coupled planar infrared heating element. The system is designed for high production flux-less void-free soldering.

SST_5100

Void-free die and substrate soldering, also known as eutectic die attach, is key to the reliability of many advanced microelectronic products. This assembly process is used when heat must be transferred away from the die or other critical components to avoid thermal failure. The presence of voids increases the die operating temperature by inhibiting efficient heat transfer through the thermal interface material (TIM). Voids may be created by flux residue, surface oxides, trapped gas and poor wetting. SST's equipment and processes minimize voids through the precise control of vacuum levels, positive pressures and thermal profiles. Typical applications include the manufacture of monolithic microwave integrated circuits (MMIC's), high power semiconductor modules, concentrated photovoltaic (CPV) solar cells, laser pump diodes, automotive rectifier diodes and microwave amplifiers.

Hermetic package sealing processes with solder or glass frit are used to isolate critical microelectronic circuits from the surrounding environment. Hermetic packaging materials are usually ceramic or metal and are sealed with a metal solder or solder-glass joint. This keeps moisture and other corrosive contaminants from damaging components and wire bond connections. Using fixtures which precisely locate package components, and applying precise thermal profiles in vacuum and positive inert gas pressures, SST's equipment creates an hermetic seal between the package seal ring and the lid which will meet the requirements of MIL-STD-883. Typical applications include the manufacture of military electronics, space-rated components, implantable medical devices, precision timing circuits and micro-electro-mechanical systems (MEMS).

Visit www.sstinternational.com to see all of the products and packaging solutions SST International has to offer. If you would like more information about hermetic sealing applications or batch reflow of AuSn eutectic application contact Palomar Technologies Assembly Services department.

Eutectic Die Attach eBook Automating MEMS Packaging AuSn Eutectic Die Attach
Automated Eutectic Die Attach eBook Automating MEMS Assembly Process and Reliability Advantages of AuSn

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David Rasmussen
Assembly Services General Manager
Palomar Technologies, Inc.