Palomar Technologies to Exhibit at SEMICON Southeast Asia 2015: Expanding Coverage of the Microelectronics Supply Chain

Carlsbad, CA – April 20, 2015 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced they are exhibiting at booth #1111 in SEMICON Southeast Asia 2015, held at the SPICE Arena in Panang, Malaysia on April 22-24.

SEMICON Southeast Asia 2015 will spotlight the latest developments in processes, equipment, materials, and emerging market opportunities in microelectronics manufacturing from more than 350 international exhibiting companies and more than 50 hours of technical and business forums.

"While Singapore continues to serve as the hub of the microelectronics industry in Southeast Asia, SEMI recognizes the growth and importance of the industry across the region requires a new vision for serving our members and other customers where they do business," said Kai Fai Ng, president of SEMI Southeast Asia. "Through the rotation of SEMICON Southeast Asia between Singapore, Malaysia, and the region, we will open new business opportunities for our customers and foster stronger pan-regional engagement in our programs and other events serving the industry. On alternating years, we will continue to support the host regions through high-level executive conferences in Singapore and Malaysia."

9000 Round Wire and Ribbon Wedge Bonder

For those looking for finer pitch applications, or high-frequency ribbon bonding, Palomar Technologies offers its recently launched 9000 wedge bonder.  This large area, deep access wedge bonder can utilize the faster 45-60 degree clamping or the deep access 90 degree clamping technology.  The clamps can be changed out to allow for both types of wedge bonding depending on your packaging requirements.

PT5-White       PT17-White

Palomar Technologies' ultra-flexible 3800 Die Bonder is designed for fully automatic, precision microelectronics assembly. The tightly regulated computer-controlled work cell performs up to three channels of adhesive dispense, component placement, eutectic die attach and flip chip operations over a spacious 35.5" x 20" work area. The 3800 Die Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions.

For a more in-depth overview, download the data sheets:

9000 Wedge Bonder Data Sheet 3800 Die Bonder Data Sheet
New Call to action 3800 Die Bonder Data Sheet

About SEMI

SEMI is the global industry association serving the nano- and micro-electronic manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

Contact Palomar Asia for tours, demonstrations and training courses.
Palomar Technologies (S.E. Asia) Pte Ltd
8 Boon Lay Way #08-09
Tradehub 21
Singapore 609964
Tel: (+65) 6686-3096
Contact online: 
http://www.palomartechnologies.com/contact-palomar-technologies-asia

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Palomar Asia Contact
Mr. PH Chan
General Manager
phchan@bonders.com
(+65) 6686-3096

Palomar Technologies Media Contact
Ms. Claudia Salerno
Marketing Communications Manager
csalerno@bonders.com
+1 (760) 931-3681