With more than 700 exhibitors and more than 26,000 participants, SEMICON West is one of the largest technical conferences that Palomar exhibits at domestically each year. Because of today’s rapidly diversifying marketplace, SEMICON West has been retooled to keep pace with the industry’s realignment. It is built around disruptive trends driving the market, and has been expanded to include all of the resources you need to survive and thrive. They have deepened their reach across the full electronics manufacturing supply chain to connect attendees with more key players.
Palomar Technologies, formerly Hughes Aircraft, has been exhibiting at SEMICON West for many, many years. Over the years, we have launched several new products at this show. Palomar first launched its venerable 3500 Die Bonder in early 1990. Almost two decades and three major versions later, we launched our 3800 Die Bonder. This January, we launched the new 3880 Die Bonder with its significantly faster bi-directional tool turret and more than double the force range. Both of these systems have been used in large quantity running 24/7/365 producing a wide variety of RF products, complex hybrids, etc. The new 3880 is ready to provide a significant increase in UPH to all markets.
Wedge Bonding
When we were still part of Hughes Aircraft, we started our first fully automatic wedge bonder, the Model 2470. It spanned from the early 1980s for almost 3 decades, 
moving through four major revisions of its platform. Last year, we launched our new 9000 Wedge Bonder with its own significant improvements, including an automatic wire despoiler that rides on theta so you never introduce any twist on the round wire or ribbon. The RGB on-axis and off-axis programmable lighting makes programming and finding PR images very simple. The 9000 is also significantly faster than the 2470, and comes with a larger 12”x6” working envelope. The unit can be configured in a 45/60 degree wire feed, or deep access with a 90 degree wire feed system and clamp; as requirements change, so does your bonder.
SST Vacuum Reflow Systems Model 5100
The advanced technology on the SST 5100 Vacuum Pressure Furnace allows users to create void-free solder joints without the use of flux. With its precise automatic control of heating and cooling ramp rates, the Model 5100 has virtually an unlimited number of process profiles that can be generated and stored. This system not only has a very wide heating and cooling range, but it can also operate at vacuum levels below 50 millitorr up to a positive pressure of 40 psig. Real-time profile graphing and data logging can be used for quality control and off-line data analysis.
Come visit us at Booth 5952 in the North Hall of Moscone Center this week. We would be happy to demonstrate each of these units while discussing total solutions to your packaging challenges.
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3880 Die Bonder
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9000 Wedge Bonder Data Sheet  |
SST Model 5100 Data Sheet  |
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Bradley K. Benton
Western Regional Sales Manager
Palomar Technologies, Inc.