Happy New Year from Palomar Technologies CEO

Posted by Jessica Sylvester on Tue, Dec 27, 2011

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I would like to take a moment and thank you for your subscription to the PTI Blog. I hope you have found each weekly post both insightful and thought provoking as the semiconductor industry continues to thrive and develop leading-edge technologies. This year generated a long list of timely topics, ranging from Hi-Rel Wire Bond Reliability to Pull Testers; Eutectic Wafer-Level Packaging to Gold-Tin Solders; and "Elemental Basics" for Interconnect Processes to simply staying on the “Technology Treadmill”.

Again, thank you for your subscription and continued participation on the PTI Blog. We look forward to sharing and connecting with you throughout the New Year!

I wish you a happy and healthy start to 2012.

Best regards,

Bruce Hueners
President & CEO
Palomar Technologies, Inc.

Tags: wafer scale packaging, automation vs. manual, wire bonding materials, AuSn, eutectic soldering process, gold tin eutectic die attach, Royce Instruments, die attach testing, wafer level packaging, gold tin die attach

Comments

Happy new year~

Posted @ Tuesday, January 10, 2012 5:06 PM by Calvin Yoo

Calvin,
Thank you for the well wishes! We hope you're having a great start to the New Year, as well. If there is anything the Palomar team can assist with, please do not hesitate to reach out.

Best,
Jessica

Posted @ Tuesday, January 10, 2012 5:23 PM by Jessica Sylvester

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