Accurate Bond-Line Thickness for Enhanced Performance of Critical Die

Today, the demands for smaller packages require highly reliable thermal coupling to associated packages. Therefore, bondline thickness must be carefully controlled. Hybond Inc.’s patented bond-line thickness measurement and die placement technology is incorporated on its model EDB-141 die bonder to greatly improve yields and thermal performance of critical die. The Hybond EDB-140B and EDB-141 series bonders use a patented approach for measuring die and package stack-up height to assure consistent bond-line thickness regardless of adhesive viscosity or die size. A built-in micrometer allows the operator to set bond-line thickness accurate within 10μm.

In the following case study, Wavestream Corporation—a manufacturing and design company focused on next-generation solid state power amplifiers for mission-critical communication systems—utilizes a Hybond EDB-141 to improve the thermal performance of their special combiners due to the excellent bond-line thickness control and custom dispensing features.

CASE STUDY:  Wavestream Corporation, San Dimas, CA

REQUIREMENT: New system required for epoxy die bonding of GaAs MMIC to increase throughput and improve yield.

EQUIPMENT SOLUTION: Hybond EDB-141, semi-automatic epoxy die bonder

Wavestream Corporation required a design solution for a single, cost-effective tabletop workstation machine to replace a combination of two of the industry's premier OEMs dispensing and die pick-and-place technologies. Hybond was able to fulfill this need for a leading epoxy dispensing machine and precision pick-and-place machine in addition to meeting the requirements for the world’s first “void directed” proprietary process—developed for production in 2007 by Y. Arthur Nakamoto; Sr. Mfg. Engineer.

GaAs ASIC MMIC contains over 200 FETs with junction temperatures exceeding 150°C. If one FET does not transfer sufficient heat due to a micro-air void, the entire MMIC typically fails and the associated financial loss can become significant. The material composition and qualification prior to use is as important as the equipment’s ability to perform to accuracy requirements.

Hybond’s Model EDB-141 has proven to be a high precision and effective machine for both R&D and production for semiconductor microwave assembly processes. The demands of a leading edge spatially combined MMIC semiconductor assembly necessitated significant investments in equipment. In Wavestream’s case, the EDB-141 epoxy die bonder has become the cost-effective tabletop standard for precision epoxy dispensing and GaAs LVASIC MMICs die bonding. 


Hybond EDB 141 Epoxy Dispenser and Pick and Place Die BonderHybond EDB-141 Epoxy Dispenser
and Pick & Place Die Bonder.

The virtually error-free PLC-based system replaces the Windows®-based software-driven system.


Hybond custom epoxy dispense pattern applied to the substrateCustom epoxy dispense pattern applied to the substrate.


Hybond split screen monitor view shows the die before pickup and the epoxy tip during dispenseSplit-screen monitor view shows the die before
pickup and the epoxy tip during dispense.


Hybond high accuracy die placementHigh-accuracy die placement.

Prior to implementation of the EDB-141, 15 linear feet was required to perform epoxy dispensing and pick and place of GaAs VLASIC MMIC. Today, the EDB-141 enables Wavestream to increase productivity by 40% by eliminating the need for two machines and two operators by substituting one highly reliable and cost-effective 6-foot workstation requiring only one operator.

Hybond EDB 141Simple and Elegant: Hybond Model EDB-141Hybond EDB 141 front view

The Hybond EDB-141 ensures continued production capability that meets the most critical processes within one machine.

The Hybond EDB-141 has become the primary die bonding machine for precision epoxy dispense and die bonding, replacing the cumbersome need for a two-machine system. The EDB-141 bench top model meets and exceeds expectations for leading edge microelectronics processes at Wavestream Corporation.

Download all of Hybond's Data Sheets here: 
Hybond Data Sheets

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Case study contributions courtesy of Bryan C. Gordon; Mfg. Process Development & Test Engineer; Wavestream Corporation, San Dimas, CA 91773 FEBRUARY 2012; www.wavestream.com.

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Palomar Technologies would like to thank Hanns Lindberg, Hybond CTO/President, for contributing as a guest blogger and sharing a valuable case study. Together, Palomar and Hybond offer customers the flexibility of options for full automation, semi-auto or manual bonding equipment, solutions and impeccable service.

For more information about the product line of Hybond, Inc. manual and semi-auto bonders, please contact Felix Mayorca, Hybond VP of Sales and Marketing, or Hybond Sales at mailus@hybond.com; or visit Hybond online at www.hybond.com.