“If you are creating high value hermetically sealed devices, what are the consequences of experiencing high voids in the package seal ...

Posted by Katie Finney on June 21

SST Vacuum Reflow Systems designs and builds systems and processes that achieve low to void-free seals for die attach component parts. ...

Posted by Katie Finney on February 28

[For the English version, click here] Данные виды монтажа очень сильно различаются. В каждом из типов имеются свои технические нюансы. ...

Posted by Katie Finney on October 18

Ball bonding starts with a gold ball on the end of a very fine wire and must be very consistent in it's Free-Air Ball (FAB) size. This is ...

Posted by Katie Finney on October 11

SEMICON West 2016 in San Francisco, CA was a great success! In the Palomar Technologies booth, we had live demonstrations of our 9000 Wedge ...

Posted by Katie Finney on August 2

March was a busy month for Palomar Technologies with exhibiting at both the iMAPS Device Packaging and OFC 2016 technical conferences. The ...

Posted by Katie Finney on April 5

Purchasing an automatic die bonder and/or wire bonder is a significant financial investment. To help ensure your company's financial ...

Posted by Katie Finney on March 1

Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, will be exhibiting at ...

Posted by Katie Finney on February 23

SST International utilizes graphite, among other materials, for tooling of microelectronics parts packaging. The superior characteristics ...

Posted by Katie Finney on February 16

[For a version of this blog in English, click here] 在上世纪70年代，当Palomar Technologies ...

Posted by Katie Finney on February 9