The Microelectronics Packaging & Test Engineering Council (MEPTEC) began over 30 years ago, and provides a forum for semiconductor ...

Posted by Janine Powell on January 16

While we are now in what is called the "information age", it is easy to lose sight of the foundation of this information age—namely the ...

Posted by Janine Powell on January 2

Often customers are wrestling with the question of which option makes more sense in their given business environment: a manual system, ...

Posted by Janine Powell on November 28

[For the English version, click here.] В начале 80-х годов компания Palomar/Hughes начала разработку и производство Клин-Бондеров для ...

Posted by Janine Powell on November 14

The relentless increase in data processing requirements, network/cloud services, computing and web bandwidth advances, and soon-to-be-seen ...

Posted by Janine Powell on November 7

Standard bonding machine pattern recognition vision systems (auto correlation based) today determine their location based on a “pixel to ...

Posted by Janine Powell on October 31

The proliferation of mobile devices, IP traffic, video-on-demand mobile and home, and Internet of Things continues to drive an exponential ...

Posted by Janine Powell on October 25

The Palomar Technologies 8000i Wire Bonder/Ball (Stud) Bumper and 9000 Wedge Bonder both have a good selection of wire bonding “loop modes” ...

Posted by Janine Powell on September 26

Gold ball bumping is primarily used to make interconnects for flip chip bonded die. This process involves placing a single bump (or stacked ...

Posted by Janine Powell on September 12

The market dedicated to optoelectronic packaging with active optical cables and/or optical transceivers is an important one in which ...

Posted by Janine Powell on August 29