Gold Ball Bumping Factors and Benefits

In wire bonding, a gold ball is forced down and thermosonically bonded to a die-bond pad forming the first connection of an integrated ...

Posted by Janine Powell on June 28

Highlights from the Conference on Lasers and Electro-Optics

The Conference on Lasers and Electro-Optics (CLEO) 2016 was the last of the “big three” photonics shows in the US (Photonics West, OFC, and ...

Posted by Janine Powell on June 21

Methods of Testing Device Hermeticity: Part 3

In part three of this series we will continue looking at the various methods for determining the leak rate of microelectronic devices with ...

Posted by Julia Picarelli on June 16

Considering an Automated Production Line?

A production line consists of multiple distinct pieces of equipment linked together to provide distinct processes of your overall part ...

Posted by Janine Powell on June 14

Simultaneous Soldering of Components

SST International has been a leader in the design and development of the innovative graphite tooling fixtures for the most complex eutectic ...

Posted by Julia Picarelli on June 3

The Importance of DC Self-Bias Voltage in Plasma Applications

In reactive ion etching (RIE) plasma processes, the parameter known as DC self-bias voltage is an important “control knob” for the ion ...

Posted by Janine Powell on June 1