PTI Blog

Wedge Bond Process Optimization

In general, there are two main types of ultrasonic wire bonding: ball bonding and wedge bonding. Although thermosonic gold ball bonding is ...

Posted by Janine Powell on

Solutions for Packaging Processes

March was a busy month for Palomar Technologies with exhibiting at both the iMAPS Device Packaging and OFC 2016 technical conferences. The ...

Posted by Katie Finney on

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