Ball Bonding vs. Wedge Bonding
For many years, wire bonding has been the most robust and commonly used method for chip-to-die interconnection of lead-frame, integrated ...
Posted by Janine Powell on
For many years, wire bonding has been the most robust and commonly used method for chip-to-die interconnection of lead-frame, integrated ...
Posted by Janine Powell on
Palomar recently exhibited at two very high tech shows in Florida: Electronics Component and Technology Conference (ECTC) and the ...
Posted by Janine Powell on
Assistance with a bonder should not begin and end with its purchase. Such complex, sophisticated machinery requires support from experts ...
Posted by Janine Powell on
[For the English version, click here.] 随着传统的混合和光电子封装频率上升,导致基本的键合工艺产生问题。主要的问题是反应性电感的产生。除此之外,反应性电容也是一个问题。但是,导线的形状从圆形改为扁带形就能直接影响反应性电感这个最关键问题。 ...
Posted by Janine Powell on
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