Multi-Chip Modules & Stacked Die Assemblies
Multi-Chip Module packaging is an important facet of modern electronic miniaturization and micro-electronic systems. Demand for further ...
Posted by Janine Powell on
Multi-Chip Module packaging is an important facet of modern electronic miniaturization and micro-electronic systems. Demand for further ...
Posted by Janine Powell on
The increasingly densely populated and higher power levels of RF & Optoelectronic packages are creating unique challenges for assembly ...
Posted by Janine Powell on
Gold (Au) ball wire bonding is still the predominate method for interconnects in microelectronics. Industries are further utilizing novel ...
Posted by Janine Powell on
Today’s microelectronic manufacturing environments seem to be constantly changing. One day you are building up traditional “flat-land” ...
Posted by Janine Powell on
Have you ever had an ink jet printer that no matter what you did to calibrate it, you still had a bit of a blur? How you must have cringed ...
Posted by Janine Powell on
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