Applications requiring ultra-high-placement accuracies of 1μm to 3μm are resurfacing in several optoelectronic applications such as Arrayed ...
Posted by Palomar Technologies MarCom Team on
High-reliability wire bonding traditionally required the addition of a security bond over the stitch—or second bond—of each ball bonded ...
Posted by Palomar Technologies MarCom Team on
Palomar Technologies Assembly Services (“Assembly Services”) offers unique assembly methods supporting flux-less Micro Ball Grid Array ...
Posted by Palomar Technologies MarCom Team on
The semiconductor market has been increasingly expanding in the Asia region—particularity in China—for producers and among consumers. In ...
Posted by Palomar Technologies MarCom Team on
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