High-brightness Matrix LED packaging

LED-based applications are growing and cover a broad range of markets including automotive lighting applications such as indicators, sport ...

Posted by Palomar Technologies MarCom Team on April 28

Benefits of Bonder Automation

I came accross an old PPT presentation authored by our CEO back in 1996,titled "Benefits of Automation". I am inspired to share it with you ...

Posted by Palomar Technologies MarCom Team on April 20

Wafer Bumping using a Ball (Stud) Bumping System

Wafer bumping involves putting a conductive material on each die pad on a wafer to attach it to a package or circuit board forming the ...

Posted by Palomar Technologies MarCom Team on April 4

Wire Bonding - Gold Ball Bumping

Gold-ball bumping - or stud bumping - can be accomplished with commercially available gold wire bonders using a 1-mil gold wire. In fact, ...

Posted by Palomar Technologies MarCom Team on April 3