Understanding where an idea came from, its context, how it was perceived by the original thinker, and the impact that idea made on the ...
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With due apologies to Jules Vern and his famous novel, we begin our 2024 blog series with an opening theme of “Around the World in Five ...
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While Engineers can get mildly enthusiastic about what the rest of the semiconductor industry perceives as unduly narrow areas of ...
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Yes, we still need to do some things by hand. Such is our collective way at looking at the world, that most of us cannot imagine, that when ...
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De-globalization, also referred to as re-shoring, is a significant trend describing much of the dynamic characterizing the semiconductor ...
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The current pace of technological change is only matched by levels in geo-economic uncertainties, themselves without parallel in over a ...
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Packaging development and process work marks the critical universe of small beginnings. Problems rightly anticipated in these earliest ...
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Many of us are familiar with the saying concerning the workman and his tools. It exposes the unfortunate tendency that, when looking upon ...
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Almost everyone has heard the saying “worth its salt”, meaning whatever has been purchased, the financial cost was more than justified by ...
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As we have noted in a previous blog, the die-bonding ecosystem has grown significantly in market size since the turn of the millennium, and ...
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The principle of inference is a practice in science that allow us to identify the impact or nature of something that is challenging, if not ...
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A well-known Danish Children’s toy company, with theme parks around the world, has recently launched its latest product aimed at grown-ups, ...
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In a previous article, we noted that the next generation of 6G and quantum encrypted communications will require the extensive use of free ...
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Risk reduction is the essence of sound business behavior, but it is often misunderstood as merely “playing safe”. Playing safe can actually ...
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In earlier blogs we considered new technologies that utilize light in the advance of health care, and the various challenges these ...
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In less than two decades the RF “family” has witnessed significant growth in the types and varieties of technology served, materials ...
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To begin, let’s start with a brief overview of wedge bonding. Unlike ball bonding, wedge bonding does not have a flame-off action, as there ...
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Palomar Innovation Centers are experts in process development and work with customers in the areas of design for manufacture, process ...
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Using the correct system, tooling, process, and making wise material choices while considering material preparation are all factors and ...
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In the blog, we review some of the theoretical principles in exploiting light for diagnostic and therapeutic uses in healthcare, and in ...
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Surfaces to be soldered in a flux-less environment must be coated prior to soldering. The most common solderable metallic coatings that are ...
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When designing semiconductor packaging, it is often easy to get caught up focusing on the function and performance of a design and not pay ...
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The journey from concept to full-scale semiconductor packaging is often hindered by a number of different obstacles along the way including ...
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Palomar Innovation Centers are experts in process development and work with customers in the areas of design for manufacture, process ...
Posted by Palomar Technologies MarCom Team on
Palomar Innovation Centers are experts in process development and work with customers in the areas of design for manufacture, process ...
Posted by Palomar Technologies MarCom Team on
It was the best of times; it was the worst of times. Yet, as always, the need is to make the most of the times. In the world of bonders and ...
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While the challenges to fully developing FMCW (frequency modulated continuous wave) LiDAR technology appear steep, the commercial value of ...
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In the same way that a good craftsman chooses with care the right tools for the job, global defense planners are adapting their strategies ...
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Capital equipment investments are justified on the basis of providing a return on investment. Capital equipment for the semiconductor ...
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The headwinds of inflationary trends, pandemic management, internal political tensions, rising competitiveness, supply chain issues, ...
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The RF power amplifier market is expected to increase substantially in the next five years, primarily as a result of the 5G rollout which ...
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With today’s rapidly changing technology, time-to-market is one of the most important factors for product success. The ability to rapidly ...
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The window from Palomar’s UK Innovation Center top floor office looks towards the Cornish coast, not too far from where Google’s Grace ...
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Over the years, microelectronic wire bond process and packaging engineers have debated whether to use ball or wedge bond technologies. This ...
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Our opening graphic contains three illustrations. Moving from left to right, these are respectively those of a stream engine, a nuclear ...
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In part three of our series on Packaging Technologies meet Quantum Opportunities, we present an overview of how KETS Quantum Security, Bay ...
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The market for the IR sensing devices has been growing steadily, but in recent years, the market experienced a rapid growth. Several ...
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This is Part 3 of a 3-part blog series on Logistic Sensor Packaging. For more information, read Part 1 and Part 2. For device ...
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This is part 2 of a 3-part blog series on Logistic Sensor Packaging. For more information, read Part 1. As a technical discipline, robotics ...
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The next few years hold out sensor opportunities concomitant to the spectacular growth in global robotics. One of the key drivers for the ...
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Power electronics are present in our everyday lives in many applications. High-efficiency lighting, elevators, motor converters, solar ...
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When it comes to the die bonding process for the assembly of RF power transistors, the most important metric is good thermal management. ...
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One of the great shifts currently taking place in global defense sensor technologies, is due to a fundamental realignment of military ...
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A traditional means to justify the expense of purchasing new bonding equipment is to calculate the units per hour (UPH) of the proposed ...
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In Part two of our series on Packaging Technologies meet Quantum Opportunities, Palomar’s Dr. Anthony O’Sullivan interviews Dr. Andrew ...
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In the early part of 2021, global analysts McKinsey & Company published a number of articles noting that the COVID crisis has led, ...
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This is the first in a 3-part blog series exploring the world of quantum technologies and its impact on semiconductor packaging. With the ...
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Much of the semiconductor packaging industry is engaged with an exciting and growing photonics ecosystem. Anticipating seven percent CAGR ...
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Auxiliary wires are commonly defined as an additional wire outside of a normal ball-to-stitch wire bond. Whether it be a pre-wire, ...
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“Necessity”, quips the proverb, “is the mother of invention.” Put colloquially, if you are desperate enough to attain a particular goal, ...
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“New space technologies … will bring about fundamental change that will influence business and our personal lives.” George Whitesides, ...
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As global COVID-19 management enters a particularly challenging race between deepening health crises and the efficacy of vaccination, all ...
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As we reflect on the events of 2020 and anticipate their unfolding in 2021, our vision sharpens to reveal a clear trifecta of forces ...
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The year of 2020 will no doubt go down in history as one of the most difficult, life-changing years of the past century. At the beginning ...
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The die bonding, or die attach process, consists of attaching a die/chip to a substrate or package. This attachment can be performed with ...
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When it comes to microelectronics and photonics packaging assembly, components such as die are placed onto packages. All automated die ...
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Process development can present many challenges in the die attach market when the optimal process or package design varies drastically. ...
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Epoxy die attach, sometimes referred to as epoxy die bonding, is the most commonly used die attach method. Whether dispensed or daubed via ...
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Eutectic die attach involves bonding a chip or die to a surface using a solder alloy. These particular solder alloys are used because of ...
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With all eyes on 2050 and the mid-century point, a highly ambitious series of global programs are in place to reduce carbon emissions ...
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In the same way that iron, steam, and the telegraph marked a mega-shift in travel and military technologies for the mid-Victorian era, new ...
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[For the English version of this blog, please click here.] ...
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[For the English version of this blog, please click here.] 在本系列的第3篇日志中，我们将介绍在喷射点胶应用的研究成果。正如我们之前在本日志系列的第2篇中所解释的，经过Palomar开发的Fixed ...
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[For the English version of this blog, please click here.] ...
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Our first blog examined the potential importance of three new technologies on the aerospace market over the next half-decade. These were ...
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[For the English version of this blog, please click here.] ...
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While lid sealing has been around for many years and is considered a legacy technology, it is helpful to revisit the topic and consider how ...
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Before the COVID-19 pandemic, passenger numbers had been expected to double over the next 15 years, meaning significant growth in aerospace ...
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HYBOND’S DFS-IV is a lightweight, compact, hand portable touch screen instrument for measuring force, ultrasonics generator board output ...
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In our last blog on combining bonder and vacuum reflow technologies, we presented a case for how to combine these technologies to ...
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"Traditional defense organizations must adapt in order to keep the nations they serve safe. The world now exists at an economic, strategic, ...
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In light of the global and local travel restrictions during this COVID-19 pandemic, we want to assure you that Palomar Technologies ...
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The COVID-19 situation is a textbook “black swan event” for the world. The unprecedented nature of this crisis makes it difficult to ...
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“Defense companies are now facing a real crisis that they cannot afford to ignore. In every region of the world, defense ministries are ...
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As we are all aware, COVID-19 is having a dramatic impact on our lives. Palomar Technologies is a key supplier to critical infrastructure ...
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The medical device market is expected to diversify significantly, almost double in value to $90 billion by 2025, but vendors face ...
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It is not uncommon to see several different kinds of back-end assembly machines operating within close proximity to one another on a ...
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The earlier blogs in this series highlighted a number of pressing dynamics in the current direction of the RF power packaging ecosystem, ...
Posted by Dr. Anthony O'Sullivan on
In the third part of this blog series, we outline our technical success in demonstrating the use of jet dispensed silver sintering. As we ...
Posted by Dr. Anthony O'Sullivan on
As we entered into 2019, I think everyone in the industry was aware that the global semiconductor market was going to offer challenges to ...
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In this second blog on pressure-less silver sintering, we set out aspects of the development work we undertook at our Innovation Center in ...
Posted by Dr. Anthony O'Sullivan on
Silver sintering technology has been around since the 1980s, but the process has faced numerous problems. The limits of traditional ...
Posted by Dr. Anthony O'Sullivan on
This blog is a snippet of larger technical paper, due for release in Q4 2019, written on the topic of eco-sustainability for packaging of ...
Posted by Redzuan Zin on
Palomar Technologies recently sent two delegates to EPIC’s Packaging Conference, hosted by ASM Amicra, in Regensburg, Germany. The annual ...
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Power Semiconductors have enjoyed steady growth for at least the last 15 years, with only the occasional down turn. It is expected that the ...
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There is a multi-trillion-dollar market developing around the world through the adoption of disruptive technology in driverless vehicles. ...
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Over the past several years, R&D spending, innovation, and invention has increased in Asia as these economies become more developed and ...
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Today, Singapore, London and Dubai lead the world when it comes to powering a world-class smart nationi, bypassing tech-savvy capitals like ...
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Palomar Technologies has a long history of serving the microelectronics and photonics markets and has provided high quality equipment and ...
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The semiconductor packaging industry continues a relentless pursuit to make smaller packages with higher throughput. The industry demand ...
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As we finish another record year at Palomar Technologies, we remain grateful for the collaborative relationships we enjoy with our ...
Posted by Bruce W. Hueners on
As we look forward to 2019, I’d like to take a moment to reflect on SST’s achievements in 2018, and to thank our customers, with whom we ...
Posted by Anthony J. Wilson on
Find out more about what Palomar Technologies Assembly Services™ has to offer, or contact us for more details. ---- Nick Evans Applications ...
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Can your manufacturing facility afford to lose $100,000 an hour to machine downtime? According to Information Technology Intelligence ...
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Photonic integrated circuits (PIC) have become an attractive platform for data center, sensing and medical devices. Thermal cameras and ...
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On May 27, 2018, the Indian Premier League (IPL) Final will be played at Wankhede Stadium in Mumbai. Millions of fans are expected to be ...
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RF GaN’s Millennial Progression Since the early 2000s, the RF market has witnessed significant amounts of investment (individual, industrial ...
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The following blog is the conclusion of a two-part finale ending a series of eight examining Current Trends in the Opto-micro-electronic ...
Posted by Dr. Anthony O'Sullivan on
The following blog is the first in a two-part finale ending a series of eight examining Current Trends in the Opto-micro-electronic and RF ...
Posted by Dr. Anthony O'Sullivan on
The following blog is the seventh in a series of eight examining Current Trends in the Opto-micro-electronic and RF Packaging Eco-systems, ...
Posted by Dr. Anthony O'Sullivan on
Recently, Palomar Technologies attended SEMICON China in Shanghai and the OFC Show in San Diego, CA. The following are our impressions of ...
Posted by Anthony J. Wilson on
The following blog is the fifth in a series of eight examining Current Trends in the Opto-micro-electronic and RF Packaging Eco-systems ...
Posted by Dr. Anthony O'Sullivan on
Our latest blog interrupts the series on Current Trends in the Opto-micro-electronic and RF Packaging Eco-systems to bring readers ...
Posted by Dr. Anthony O'Sullivan on
The following blog is the fourth in a series of eight examining Current Trends in the Opto-micro-electronic and RF Packaging Eco-systems ...
Posted by Dr. Anthony O'Sullivan on
The following blog is the third in a series of eight examining Current Trends in the Opto-micro-electronic and RF Packaging Eco-systems, ...
Posted by Dr. Anthony O'Sullivan on
This blog is the second in a series of eight examining Current Trends in the Opto-micro-electronic and RF Packaging Eco-systems giving ...
Posted by Dr. Anthony O'Sullivan on
The following blog is the first in a series of eight examining Current Trends in the Opto-micro-electronic and RF Packaging Eco-systems ...
Posted by Dr. Anthony O'Sullivan on
The Microelectronics Packaging & Test Engineering Council (MEPTEC) began over 30 years ago, and provides a forum for semiconductor ...
Posted by Janine Powell on
While we are now in what is called the "information age", it is easy to lose sight of the foundation of this information age—namely the ...
Posted by Janine Powell on
Often customers are wrestling with the question of which option makes more sense in their given business environment: a manual system, ...
Posted by Janine Powell on
[For the English version, click here.] В начале 80-х годов компания Palomar/Hughes начала разработку и производство Клин-Бондеров для ...
Posted by Janine Powell on
The relentless increase in data processing requirements, network/cloud services, computing and web bandwidth advances, and soon-to-be-seen ...
Posted by Janine Powell on
Standard bonding machine pattern recognition vision systems (auto correlation based) today determine their location based on a “pixel to ...
Posted by Janine Powell on
The proliferation of mobile devices, IP traffic, video-on-demand mobile and home, and Internet of Things continues to drive an exponential ...
Posted by Janine Powell on
The Palomar Technologies 8000i Wire Bonder/Ball (Stud) Bumper and 9000 Wedge Bonder both have a good selection of wire bonding “loop modes” ...
Posted by Janine Powell on
Gold ball bumping is primarily used to make interconnects for flip chip bonded die. This process involves placing a single bump (or stacked ...
Posted by Janine Powell on
The market dedicated to optoelectronic packaging with active optical cables and/or optical transceivers is an important one in which ...
Posted by Janine Powell on
[For the English version, click here.] “如果您正在生产高价值的密封元件，在封装密封环中产生高空隙的后果是什么？” 封装密封圈中高度的空隙可能会导致泄漏故障，从而降低元件的可靠性和性能。 ...
Posted by Janine Powell on
When it comes to microelectronics assembly, there are many challenges and solutions. One of the most critical differences between a manual ...
Posted by Janine Powell on
[For the English version of this blog, click here.] Les interconnexions en câblage filaire dans l’électronique on traditionnellement été ...
Posted by Janine Powell on
Last year, I wrote a blog about general EFO theory. This edition will focus on the history of the “flame-off” and a few more advanced ...
Posted by Janine Powell on
“If you are creating high value hermetically sealed devices, what are the consequences of experiencing high voids in the package seal ...
Posted by Katie Finney on
“If you are creating high value hermetically sealed devices, what are the consequences of experiencing high voids in the package seal ...
Posted by Julia Picarelli on
[View the blog in English here.] 今天, 绝大部分的高生产焊接电子元器件应用都 使用带式焊炉。带式焊炉的典型长度超过20英尺。这些高批量生产流程需要 <200 ppm 氧气水平, 氮气冲洗 (以达到如此低的 ppm 氧气水平) 和恒定的 ...
Posted by Janine Powell on
Microelectronic Mechanical Systems, or MEMS, technology is everywhere we look. The biotech, medical device, communications, and inertial ...
Posted by Janine Powell on
The specialized semiconductor grade graphite tooling manufactured by SST Vacuum Reflow Systems can be used for many years with proper ...
Posted by Julia Picarelli on
Sometimes we get requests from customers or potential customers needing a bonder right away. Of course, we try to do everything we can to ...
Posted by Janine Powell on
MEMS technology is everywhere we look. The Biotech, Medical Device, Communications and Inertial Sensing segments are increasingly using ...
Posted by Julia Picarelli on
In many bonding applications, whether for die attach or wire bond, a successful bond can depend greatly on the method by which the parts ...
Posted by Janine Powell on
Palomar Technologies modern bonding systems have a multi-decade history, with system software that has been continuously improved upon in ...
Posted by Janine Powell on
Today, in the majority of high production soldering of electronic component applications, belt furnaces are used. The typical length of a ...
Posted by Julia Picarelli on
Did you know that Palomar Technologies has thousands of systems installed worldwide and serviced directly by Palomar? Take a look into our ...
Posted by Janine Powell on
Palomar Technologies has exhibited at two large Optoelectronic Technical Conferences in the last 2 months. SPIE Photonics West was held in ...
Posted by Janine Powell on
SST Vacuum Reflow Systems recently exhibited its systems and services at SEMICON China in Shanghai.At the show, we introduced a new ...
Posted by Julia Picarelli on
Whether you are placing components for die attach or creating wire bonds (ball or wedge), a good quality connection requires that the ...
Posted by Janine Powell on
Palomar has successfully worked with the global contract manufacturer Fabrinet over the last several years, working with our mutual ...
Posted by Janine Powell on
Typical applications for the family of SST Vacuum Reflow Systems are: Package Assembly, Lid Attach, Die Attach, Glass to Metal Seals, and ...
Posted by Julia Picarelli on
SST Vacuum Reflow Systems designs and builds systems and processes that achieve low to void-free seals for die attach component parts. ...
Posted by Katie Finney on
In August last year, we discussed the life cycle cost savings that can be enjoyed by upgrading from old DAP 2200 series soldering furnaces. ...
Posted by Julia Picarelli on
SST Vacuum Reflow Systems offers customers far more than just high performance vacuum/pressure soldering systems. When acquiring a system, ...
Posted by Julia Picarelli on
[For the English version, click here.] 液体助焊剂 （酸性底或无机底）传统上的主要用途是使氧化的金属表面产生高质量的焊料润, 导致金属零件之间更有效的焊接。然而，使用助焊剂同时也对焊接造成重大的缺陷。 缺陷#1︰ ...
Posted by Janine Powell on
You’ve made an investment in your SST Vacuum Reflow System and want to keep it producing at a high level. To ensure systems operate at peak ...
Posted by Julia Picarelli on
The semiconductor industry saw the highest-ever annual sales in 2016, totaling $338.9 billion, according to the Semiconductor Industry ...
Posted by Janine Powell on
There are many different directions to go in when it comes to part presentation stages—from that simple part built by the thousands yearly, ...
Posted by Janine Powell on
After investing in a sophisticated and complex piece of capital equipment, you expect to maximize its performance and minimize life-cycle ...
Posted by Julia Picarelli on
Selecting the right solder alloy for your application is crucial to the success of the project. If the right solder alloy is not selected ...
Posted by Janine Powell on
[Read the English version of the blog here.] Bien que la tendance évolue défavorablement envers le fil d’or dans le câblage de grande ...
Posted by Janine Powell on
Liquid flux (acidic base or inorganic based) has traditionally been the primary solution to allow soldering of metal parts with surface ...
Posted by Janine Powell on
Wire bonding is a well-known process that has been around for many decades. It was all performed manually from the mid-1950s to the late ...
Posted by Janine Powell on
To say that 2016 has been an interesting year is probably an understatement for most of us in the electronics business. The pace of change ...
Posted by Julia Picarelli on
Again, there is much to be thankful for as we close out 2016. Certainly microelectronics remains one of the key components of our world ...
Posted by Janine Powell on
Assembly Services has two separate processes available for eutectic bonding available in our lab. We can utilize our 3880 or 6500 Die ...
Posted by Janine Powell on
[Read the English version of the blog here.] SST Vacuum Reflow Systems ...
Posted by Janine Powell on
As you know, the microelectronics industry is always growing and changing. We grow and change along with it, staying ahead of the next ...
Posted by Janine Powell on
There are literally hundreds of solder alloys available from very low melting points from 38°C to extremely high brazing melting points to ...
Posted by Janine Powell on
In March 2015, Palomar Technologies acquired SST International, a turnkey supplier of vacuum and pressure furnaces for soldering, brazing, ...
Posted by Janine Powell on
Due to the accuracy and flexibility of our systems (along with the decades of experience and knowledge of our staff), we often get to work ...
Posted by Janine Powell on
All of Palomar Technologies’ robotic bonding systems utilize Microsoft® Windows® as the core operating system. Windows has been used on our ...
Posted by Janine Powell on
[For the English version, click here] Данные виды монтажа очень сильно различаются. В каждом из типов имеются свои технические нюансы. ...
Posted by Katie Finney on
Ball bonding starts with a gold ball on the end of a very fine wire and must be very consistent in it's Free-Air Ball (FAB) size. This is ...
Posted by Katie Finney on
Previous blogs have detailed the value of using graphite elements and tooling for precise temperature control, wide temperature ranges, and ...
Posted by Julia Picarelli on
Although the Palomar Technologies Assembly Services™ group has been around for more than 8 years we often get asked if we know somebody ...
Posted by Janine Powell on
The differences between eutectic and epoxy die attach are many. There are some obvious trade-offs and benefits to both, most of which ...
Posted by Janine Powell on
Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch ...
Posted by Janine Powell on
SST designs tooling to precisely locate solderable components to our customer’s requirements. The methodology that the package designer ...
Posted by Julia Picarelli on
[For the English version of this blog, click here.] ...
Posted by Janine Powell on
The advancements in user interfaces of devices from cell phones to automobiles seem to increase in terms of capabilities on a daily basis. ...
Posted by Janine Powell on
It seems that we upgrade phones, software, and computers every couple of years to take advantage of the latest and most reliable technology ...
Posted by Julia Picarelli on
Have your engineers ever encountered challenges with locating parts while working with a die or wire bond application? This can be a ...
Posted by Janine Powell on
With over 30 years in the business, Palomar Technologies and Royce Instruments both have a rich history of microelectronics equipment ...
Posted by Janine Powell on
Hybrid components and high-power communication devices are classified as high-performance and high-capacity die attach applications. These ...
Posted by Janine Powell on
SEMICON West 2016 in San Francisco, CA was a great success! In the Palomar Technologies booth, we had live demonstrations of our 9000 Wedge ...
Posted by Katie Finney on
The QuikCool rate profile achieves lower void concentration versus normal rate profile in AuSn solder alloys. AuSn is the “best” alloy to ...
Posted by Julia Picarelli on
[For the English version, click here.] В течение многих лет разварка проволочных перемычек является самым надежным и широко используемым ...
Posted by Janine Powell on
With more than 700 exhibitors and more than 26,000 participants, SEMICON West is one of the largest technical conferences that Palomar ...
Posted by Janine Powell on
In wire bonding, a gold ball is forced down and thermosonically bonded to a die-bond pad forming the first connection of an integrated ...
Posted by Janine Powell on
The Conference on Lasers and Electro-Optics (CLEO) 2016 was the last of the “big three” photonics shows in the US (Photonics West, OFC, and ...
Posted by Janine Powell on
In part three of this series we will continue looking at the various methods for determining the leak rate of microelectronic devices with ...
Posted by Julia Picarelli on
A production line consists of multiple distinct pieces of equipment linked together to provide distinct processes of your overall part ...
Posted by Janine Powell on
SST International has been a leader in the design and development of the innovative graphite tooling fixtures for the most complex eutectic ...
Posted by Julia Picarelli on
In reactive ion etching (RIE) plasma processes, the parameter known as DC self-bias voltage is an important “control knob” for the ion ...
Posted by Janine Powell on
Moisture on microelectronic components has a history of failure-inducing effects. These include electrical leakage, corrosion of metal ...
Posted by Janine Powell on
Designers of electronic packages require that their components be located very precisely; however, sometimes the positional tolerance of ...
Posted by Julia Picarelli on
Do you happen to know someone who does not own some type of wireless device? It is becoming rarer today to meet someone who does not. ...
Posted by Janine Powell on
[For the English version, click here.] Palomar 公司SST 国际推荐，设计，并制作有加上重量, ...
Posted by Janine Powell on
We have the privilege and opportunity to work with customers who are ready to make the leap from a manual production environment to a fully ...
Posted by Janine Powell on
[For the English translation, click here.] Les machines de câblage de Palomar Technologies utilisent depuis plusieurs années la technologie ...
Posted by Janine Powell on
Having the right preform size affects yield in a big way. Preform suppliers offer custom size preforms, and with existing in-house tooling ...
Posted by Julia Picarelli on
In general, there are two main types of ultrasonic wire bonding: ball bonding and wedge bonding. Although thermosonic gold ball bonding is ...
Posted by Janine Powell on
As we continue this series on the Methods of Testing Device Hermeticity According to MIL-STD-883, we will start looking at the various ...
Posted by Julia Picarelli on
March was a busy month for Palomar Technologies with exhibiting at both the iMAPS Device Packaging and OFC 2016 technical conferences. The ...
Posted by Katie Finney on
The SST Family of Furnaces has the ability to store hundreds of profile recipes. Most customers, however, only have a handful of commonly ...
Posted by Julia Picarelli on
Purchasing an automatic die bonder and/or wire bonder is a significant financial investment. To help ensure your company's financial ...
Posted by Katie Finney on
SST recommends, designs, and fabricates tooling for die attach and lid seal with weights. Free floating individual weights are used for ...
Posted by Julia Picarelli on
Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, will be exhibiting at ...
Posted by Katie Finney on
SST International utilizes graphite, among other materials, for tooling of microelectronics parts packaging. The superior characteristics ...
Posted by Katie Finney on
[For a version of this blog in English, click here] 在上世纪70年代，当Palomar Technologies ...
Posted by Katie Finney on
Computer and software performance is vital to maintaining peak production performance, especially for complex hybrid manufacturing. ...
Posted by Katie Finney on
SST Vacuum Reflow Systems recently introduced an upgrade for graphite tooling. Over time, the thermocouple hole on the side of the boat ...
Posted by Julia Picarelli on
There was a time when our hi-rel customers would typically use what they called a “security bond” on the stitch bonds of their packages. ...
Posted by Katie Finney on
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