Palomar® Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.
Palomar® Technologies provides packaging solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, Palomar now supports a wide range of industries including automotive, lasers, LEDs, medical & bio photonics, military/high reliability/MEMS, power semiconductors, RF/microwave/wireless, sensors and telecom/5G/Datacom. Select your industry to learn about Palomar’s solutions.
Palomar® Technologies offers multiple locations with full-service OSAT laboratories which provide volume manufacturing, process development, package prototyping, assembly, test, and measurement for processes such as die attach, wire bonding, vacuum reflow, and more.
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Contact us for more info about our Total Process Solution including die bonders, wire and wedge bonders, SST vacuum reflow systems, and Innovation Centers.
New Product Introduction (NPI)
We shorten time-to-market for the process development phase of your NPI. This is made possible by tapping into Palomar’s 35 years of precision die attach and wire bond process experience and expertise. Automated assembly machines are only part of the total solution—a well-developed and stable process that uses readily available automated machines for ultra-high accuracy component placement attach and wire bonding is critical to long-term success.
As the process maturing phase is underway, Palomar enables you to simultaneously deliver tangible working products to your customers—this is how we shorten your time-to-market. We can help you do it without having to make the larger investment