Contract Assembly in the USA Custom Machine/Process  Support Automating MEMS Assembly

Laboratory Capabilities

Palomar Technologies Assembly ServicesTM ("Assembly Services") laboratory capabilities continually develop and expand to meet your contract microelectronics packaging needs.

Die Attach

Wire Bonding

Test and Measurement

Environment, Services and Materials

Die Attach Methods

  • Epoxy (computer-controlled)
  • Eutectic (computer-controlled)
    - Pulsed Heat System
    - Steady State
  • Thermocompression attachment

Wire Bonding Methods

  • Stand-off stitch
  • One-step gold planar
  • Security bonds
  • Chain bonding (wedge bond emulation)
  • Tab bonding

Scanning Electron Microscope (SEM)

  • Sub-micron measurement

Wafer sizes Ranging ip to 300mm

  • Forming gas, N2 and H2/N2

Die Size Range

  • 0.006 square up to 2 inches square (175um to 50.80mm)
  • Larger size capability depending on desired application

Wire Size Range

  • 0.0005 to 0.0002 inches (0.01270 mm to 0.00508 mm)

Video Measurement

  • Stero zoom microscopes
  • 3D-laser scanning microscope with sub-micron accuracy
  • 2D/3D color high-magnification microscope with micron accuracy

Gold Tin

  • Preforms or prementalized on die or substrate

Gold Silicon

Die Attach Materials

  • Eutectic solder preforms
  • Pre-deposited AuSn
  • AuGe
  • AuSn
  • AuSi
  • PbSn
  • Conductive epoxies
  • High-performance conductive epoxies
  • Non-conductive epoxies
  • Anisotropic adhesive (ACP)
  • UV cure adhesives
  • Snap cure adhesive

Wire Bonding Materials

  • Gold (Au)
  • Platinum (Pt)
  • Aluminum (Al)

Scanning Acoustic Microscope (SAM)

  • Performs void detecting

Supply Chain Management

  • Purchasing
  • Shipping and receiving
  • Secure warehouse
  • IP confidentiality

Die Attach Applications

  • HB LEDs
  • Stacked die (3D chip attach)
  • Direct chip attach
  • Hybrids (medical, military apps)
  • P-side down laser diode attachment
  • Silicon bench (v-groove) placement
  • Ultra-fine pitch hybrid assemblies
  • VCSEL modules

Wire Bonding Applications

  • HB LEDs
  • Lens attach
  • MCMs
  • Large complex hybrids
  • Solar concentrator
  • Flex circuits
  • System in packages (SIP)
  • Automotive assemblies
  • Specialty lead frames
  • Fine pitch devices
  • Chip-on-board (COB)

Palomar Partnerships

  • Component handling
  • Wafer saw
  • Surface mount
  • Package sealing
  • Failure analysis services
    - X-section
    - Elemental analysis
    - X-ray microscope

Computerized Paperless Manufacturing Infrastructure
Laboratory

  • Class 1000-10000 clean rooms
  • Secure work areas
  • Paperless work order flow tag (WOFT)
  • Temperature, humidity, ionization control
  • Electro-static discharge (ESD)

Die Attach Accuracy

  • Eutectic range: 1 - 7 microns
  • Epoxy range: 2 - 10 microns

Wire Bonding Placement Accuracy

  • +/-2 micron, 3 sigma 

Pull & Shear Tester

  • Die
  • Ball
  • Wire
  • Stud

Specialized Plating and/or Sputtering Partnerships

  • Component transfer and/or die sorting
  • Dicing/wafer saw
  • Material procurement

Types of Die Bonding

  • Eutectic scrub
  • Pick-and-place attach
  • Flip chip
  • Epoxy die attach

Types of Wire Bonding

  • Ball bonding
  • Ball bumping
  • Stud bumping
  • Chip bumping
  • Wedge bonding
  • Chain bonding

Customer Specific Test Sets*

  • RF
  • DC
  • PHOTONIC
  • LEDs

*partial list

Process Development

  • Palomar Application Engineers can develop your process in-house, or we can form a research and development partnership with your company

Die Attach Features

  • Deep access die attach
  • Large work area
  • Ultra-high accuracy

Wire Bonding Features

  • Deep access wire bonding
  • Versatility
  • Large work area

Plasma Cleaning

  • Single gas
  • Multiple gas
    - Argon
    - Oxygen
    - Forming gas

Prototyping

  • Palomar Application Engineers evaluate prototype devices and manufacturing methods quickly and efficiently