System in a Package (SiP) technology was designed for multiple advanced packaging applications to create solutions that can be customized depending on the need of the user. A system-in-a-package (or system in package) is a number of integrated circuits enclosed in a single package or module.
No two customers are alike. There are differences in microelectronic challenges as well as differences in concepts and desired end results.
- Lower cost of ownership (due to more efficient ICs and multiple ICs in one package)
- Reduced cycle times for system design
- Higher levels of integration
- Smaller size with increased functionality (compared to individually packaged ICs)
- Greater flexibility in product development
Applications for System in a Package:
|
|
|
- High Power Communication Devices
|
|
- High Density Single Module Computers
|
|
|
|
|
- Military and Space Avionics
|
|
How it Works
The SiP performs all or most of the functions of an electronic system. Dies containing integrated circuits may be stacked vertically on a substrate. They are internally connected by fine wires that are bonded to the package. Alternatively, with a flip chip technology, solder or gold ball bumps are used to join stacked chips together. SiP dies are stacked vertically, unlike slightly less dense multi-chip modules, which place dies horizontally alongside one another. SiP connects the dies with standard wire bonds or solder bumps, unlike slightly denser three-dimensional integrated circuits which connect stacked silicon dies with conductors running through the die utilizing “through silicon vias” (TSV).
An example SiP can contain several chips—such as a specialized processor, DRAM, flash memory—combined with passive components—resistors and capacitors—all mounted on the same substrate. This means that a complete, functional unit can be built in a multi-chip module so that few external components need to be added to make it work. This is particularly valuable in space constrained environments as it reduces the complexity of the printed circuit board and overall design.
System in a Package is now breaking into a related application called Chip Stack MCM. Chip Stack MCM is also commonly referred to as a "chip stack package" and is a new development in MCM technology. Well designed substrates allow die to be stacked in a vertical configuration making the MCM's footprint much smaller. The trade off is that the chip becomes thicker (or taller). Devices that utilize this are ones that require high power in a small area, such as miniature electronics.
