Fine pitch devices are those requiring close proximity to other wires, diodes or any other aspect of a device package. Fine pitch applications usually require a more sophisticated or capable wire bonder. Factors at work are tight control of bonding force, ultrasonic energy level, and the looping capability of the wire (reverse loops, long loops, short loops, low loops). Looping capability with fine pitch wires becomes an important consideration due to the greater possibility of loop sway.
