APPLICATIONS

Applications

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Applications - Solving Your Packaging Challenge

customizing machine for microelectronic applicationsBy participating in a pre-quotation study with the customer, Palomar Technoloies applications engineers help clarify and define the appropriate equipment or service needed. Once equipment selection is made and manufacture is complete, the apps engineer can demonstrate the chosen machine’s capabilities using a customer’s parts and programs.

 

 

Tell Us Your Challenge

Palomar Technologies provides solutions for a wide variety of application requirements for first level interconnect of microelectronic packages. Its fundamental capabilities for large area, high-precision and high-performance assembly make Palomar Technologies a supplier of choice.

Process capabilities listed are the foundation of our business for equipment and contract assembly.

wire bonds

Wafer Scale Packaging
Optoelectronic Packaging
Laser Diode Packaging
Wedge Bonding
Eutectic Die Bonding
Epoxy Die Bonding
Gold Stud Bumping / Gold Ball Bumping
RF Device Packaging
Power Amplifiers Packaging
Power Transistor Packaging

These capabilities are applied to the aerospace and defense, medical, telecommunications and consumer high technology markets.

Check out the PTI-Blog to learn more about these applications on an individual level.

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